Virtual THERMINIC 2020 – Siemens sponsors thermal conference

By John Parry

This year THERMINIC 2020, Europe’s premier electronics thermal event, devoted to thermal effects from ICs to electronics systems is going virtual.  THERMINIC will take place online 24th September and will combine video presentations with an exciting and interactive digital conference format. Siemens Digitial Industries Software is sponsoring this online conference.

Find out more about virtual THERMINIC 2020

Keep up to date as the committee, which I am a member of, finalize the agenda and the details of the innovative new format to bring you the most inspiring, lively, interactive THERMINIC Workshop that the current circumstances allow.  By my count, there will be a total of 56 presentations, all backed by technical papers in the proceedings.

Register now as a regular virtual attendee for €116 to look forward to live presentations of the keynote and the 15 highest ranked papers, short pitches of all other presentations, live debates and the best paper award ceremony! Registration includes access to the conference proceedings.

2020 Keynote at THERMINIC Announced

This year’s keynote will be given by Dr. Stefan Stegmeier. Dr. Stegmeier has studied technical physics at the University of Applied Science in Munich with the main focus on “material science”. In 2010 he received his PhD from the Otto-von-Guericke University, Magdeburg, in the field of electronics/chemical sensors with a strong focus on nano technology. Since 2010 he is a project manager at Siemens in the field of electronics and mechatronics where he mainly researches topics such as sensors, lighting, semiconductor technologies and (power) electronics. As a principal key expert scientist, he is substantially responsible for innovative process technologies and for shaping Siemens technologic strategy in the field of electronics. He published more than 20 journal/conference papers and holds more than 30 patents in the area of chemical sensors, optoelectronic semiconductors, packaging of electronics, novel technologies for industry applications and power electronics.

Dr. Stegmeier’s talk is on “Future trends in industry (power) electronics manufacturing – small lot size production and its effect on product thermal management” in which he will explain the need to adapt cooling concepts and the thermomechanical reliability of power electronics.

Siemens and other sponsors support THERMINIC 2020

Together with Huawei and Heraeus, Siemens Digital Industries Software is again sponsoring THERMINIC in its virtual online format as we have done with physical events in the past. Sponsorship packages are still available if your company is interested. The conference organizers are anticipating an expanded attendance due to the smaller time commitment, no travel costs and reduced conference fee.

Siemens Digital Industries software will be giving vendor presentation to talk about the latest Simcenter solutions for electronics cooling simulation, such as Package Creator shown below, thermal characterization measurement and reliability testing.

Please register to attend. Siemens and THERMINIC organizers look forward to seeing you online September 24th.

Dr John Parry, CEng.

Publicity Chair, THERMINIC Steering Committee.

Package Creator in Simcenter Flotherm 2020.1 showing new Chip Array package

This article first appeared on the Siemens Digital Industries Software blog at