3D IC Physical Design Workflow – ep. 5
One of the challenges of designing 3D IC chips is getting data from different sources in various formats to work together. You also need a solution that allows you to verify different components such as the interposer, the package and the die together. Siemens solution allows you to combine data from distinct sources and handle the verification process collectively.
Today, John McMillan interviews Mike Walsh, Technical Applications Engineering Director of the Technical Solutions Sales Team at Siemens Digital EDA. He’ll help us understand what a 3D IC physical design workflow might look like.
In this episode, you’ll learn about the challenges associated with 3D IC physical design. You’ll also gain insight about how a Siemens solution enables design teams to use data received in diverse formats. Additionally, you’ll understand why it’s important to keep verification in mind early on in the design process.
What You Will Learn in this Episode:
- The challenges faced in the 3D IC physical design phase (01:33)
- The importance of a design solution that can deal with multiple data formats (03:39)
- How Siemens helps organizations combine data from different sources in different formats (07:55)
- The different aspects of 3D IC design flow (12:06)
Mike Walsh
Technical Applications Engineering Director of the Technical Solutions Sales Team at Siemens Digital EDA
3D IC
Three-dimensional integrated circuits take less space and deliver higher performance.
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