Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Thought Leadership

How green hydrogen can energize a better energy transition – Transcript

Not every technology can run on electricity, they need fuel. This is why green hydrogen is so vital.
Marine

The strategic copilot: AI-enhanced marine engineering is driving business impact

AI-enhanced workflows in marine engineering act as a strategic copilot, accelerating design cycles by up to 20%, reducing design costs by 10% and improving hydrodynamic efficiency by 8%+ while retaining human oversight.
Simcenter

The relentless pursuit of the perfect lap

The virtual driver: motorsport’s ultimate weapon in the war for lap time A single motorsport test campaign can cost millions...
Rapidminer

7 steps to seamless SAS language migration with Rapidminer SLC

This article demystifies the SAS language migration process, offering a clear, step-by-step guide to transitioning your analytics infrastructure with Rapidminer...
Teamcenter

Manage PLM files from your desktop with Teamcenter Drive

Product information is most valuable when people can easily access and work with it. But when we’re talking about PLM...
Teamcenter Manufacturing

The Path to Manufacturing Excellence in Aerospace and Defense [VIDEO]

A&D manufacturers lose time and money when design, manufacturing and quality engineering aren't connected. Watch the full interview as Zvika Weissman, Director of A&D Solutions at Siemens, explains how AI, a single source of truth and production digital twins help plan and validate first-time-right production.
Service Lifecycle Management

Turn product support insights into lifecycle savings with Teamcenter PSDM

David Riemer, CEO of Intermountain Space Consulting, explains why sustainment costs are shaping acquisition decisions and pushing OEMs to consider logistics earlier in design. See how Teamcenter Product Support Data Management (PSDM) connects design and logistics data to optimize maintenance and asset performance.
Custom IC

Inside Bengaluru’s semiconductor hub: Key highlights from the Solido Custom IC Forum 2026

Highlights from Solido Custom IC Forum 2026: AI-powered innovations, agentic EDA workflows and frontline custom chip design and verification
Semiconductor Packaging

Scaling 3D IC design: Trends, challenges and practical workflows

Part 1: The reticle limit, advanced packaging and the multiphysics challenge Authors: Kevin Rinebold and Andras Vass-Varnai, Ph.D. This blog...
View our podcasts