Semiconductor Industry Report: Mid-2023 Trends and Insights

Summary An explosion of complexity is happening in the semiconductor industry. Digital solutions provide a key opportunity to harness this…

Unveiling the Beneficial Secrets of Production Costing – Siemens Webinar Recap

In a recent Siemens Digital Industry Software webinar, we explored the intricacies of production costing in electronics manufacturing. This recap…

Siemens presentation at Realize Live in Las Vegas 2023

Shifting-Left – Accelerating Semiconductor Product Development

The fragmented state of the semiconductor lifecycle and value chain can be chaotic. In turn, this creates disruption and quantifiable…

Image of a printed circuit board held by machinery inside an electronics manufacturing plant using intraplant logistics

The electronic manufacturer’s guide to mastering material flow using intralogistics

In electronics manufacturing, efficiency is critical to competitiveness. Optimized intra plant logistics or intralogistics can revolutionize how manufacturers handle materials,…

printed circuit board with design overlay for thermal design consideration

A hot topic: die attach thermal testing for power electronics components

Power electronics components improve the energy efficiency of electric machines and motors across all industries and applications. These power electronic…

Electronics manufacturing line engineer with superimposed intra plant logistics digital twin

Smart intra plant logistics: the key to unlocking supply chain superpowers

The global pandemic dramatically altered the way consumers connect, compute and communicate. Consumers needed more devices to connect for work…

integrated semiconductor

As Manhattan discovered, going vertical presents challenges. Siemens PLM and EDA solutions can help (Part 2 of 2)

See the latest advancements in PLM and EDA solutions to meet advanced packaging challenges at the 19th annual Device Packaging Conference (DPC 2023), or on demand after the show.

integrated semiconductor

From Manhattan to advanced package design: how Siemens PLM and EDA solutions can help (Part 1 of 2)

Discover the latest advancements in PLM and EDA solutions to meet the challenges of advanced package design at the 19th annual Device Packaging Conference (DPC 2023).

Set teams up for success with blueprints for product development using MBSE

Model-based systems engineering (MBSE) for electronics

Exploring design alternatives with MBSE for electronics Connectedness starts at the beginning of the design process when there is a…

Siemens Semiconductor eBook by Fram Akiki Cover Photo

Exciting opportunities ahead for smart semiconductor manufacturing!

These are exciting times for the semiconductor industry.  Chips are powering an ever-diverse set of applications from smartphones and personal…