The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

An engineer is working at a computer workstation with multiple monitors displaying electronic system designs and schematics. The title above the image reads "Electronic systems design: Blog series - Part 2 Accelerating mechanical and electrical design".

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

A man in a fshipping factory looking over the work on a tablet. The image reads the blogs title name.

Bridging the gaps in electronic systems design Blog series | The power of an integrated platform – Part 1

In today’s rapidly evolving electronics industry, companies face unprecedented challenges in developing complex, innovative products within tight schedules and budgets….

Evolving from Lean Manufacturing to Smart manufacturing for Semiconductors

From Lean to Smart: Taking the next steps in Lean Semiconductor Manufacturing with Siemens

In the dynamic and ever-evolving world of semiconductor manufacturing, the pursuit of efficiency and quality has been an enduring challenge….

Streamlining BOM management and product configuration in the cloud

The world of electronics product development is evolving at a rapid pace. As products become more complex and teams become…

Toward a people-centric and adaptive production ecosystem. 

Topic 4 in our Blog Series, Sustainability in Semiconductors. Every Detail Matters.   Hannover Messe 2024, the world’s leading industrial trade…

Semiconductor design innovation: how EDA initiates the digitalization journey for a smarter, sustainable future.  

Topic 3 in our Blog Series, “Sustainability in Semiconductors. Every Detail Matters.”  Hannover Messe 2024, the world’s leading industrial trade…

Siemens Hi-Tech Factory Digital Twin

Scale up Smart to reduce carbon.  

Topic 2 in our Blog Series, “Sustainability in Semiconductors. Every Detail Matters.” Hannover Messe 2024, the world’s leading industrial trade…

A lush green forest with a blue river running through it.

Smart is Sustainable.  

A world in critical need of a sustainable future needs smart manufacturing for semiconductors.

Siemens at Hannover Messe 2024: Semiconductors Go Digital – Achieve sustainable manufacturing from design to production. 

Siemens is offering our blog readers an exclusive sneak peek to our Semiconductors Go Digital sustainable manufacturing message at Hannover Mess 2024 through our blog series, “Sustainability in Semiconductors. Every Detail Matters.”