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Achieving manufacturing excellence in 3D IC design

June 4, 2025

The semiconductor industry is undergoing a pivotal evolution, fueled by the adoption of 3D IC and innovative packaging technologies. Achieving…

By John McMillan
2 MIN READ
The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

June 20, 2024

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

By Michael Munsey and Gabriella Leone
3 MIN READ