Learning Resources - Electronics & Semiconductors

Accelerate digital transformation in electronics

March 17, 2025

Explore the five essential steps to drive digital transformation in your electronics business with our compelling eBook…

By Mandar Lele

< 1 MIN READ

Diagram showing how to connect people and processes with PLM, ERP, and MES data into one environment

Seamless collaboration across the supply chain with semiconductor product lifecycle management (PLM) (Part 3 of 3)

October 30, 2024

In our first and second posts, we talked about shifting left for smart manufacturing and smart semiconductor manufacturing execution. The…

By Katie Tormala

2 MIN READ

Semiconductor manufacturing execution system diagram, from raw materials to front-end, back-end, and PCB/MCMs with benefits listed: improve productivity, improve quality, realize cost savings, improve NPI, modern MES

From Lean to Smart Semiconductor Manufacturing Execution (Part 2 of 3)

September 30, 2024

Traditional lean manufacturing brings benefits, but smart manufacturing can propel progress further to amplify profit margins and foster adaptability. In…

By Katie Tormala

3 MIN READ

Visual of digitalization of data through semiconductor design process

Shorten NPI time-to-market or zero-defect chips: do you have to choose?

August 13, 2024

Semiconductor customers seem to need it all – new products, fast delivery and zero defects. As we shared previously, fragmented…

By Katie Tormala

2 MIN READ

The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

June 20, 2024

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

By Michael Munsey and Gabriella Leone

3 MIN READ

printed circuit board with design overlay for thermal design consideration

A hot topic: die attach thermal testing for power electronics components

May 2, 2023

Power electronics components improve the energy efficiency of electric machines and motors across all industries and applications. These power electronic…

By Katie Tormala

4 MIN READ