Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB…
Late last week you may have seen the open letter from our CEO, Tony Hemmelgarn, laying out the steps that…
HyperLynx is industry-renowned for ease of use, with automated workflows that make sophisticated analysis accessible to designers new to power…
If you’re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you…
