What’s New in Xpedition® IC Packaging Design for VX 2.7

Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. They also deliver a complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling.

Here are some highlights of the Xpedition® VX. 2.7 IC Packaging design tools release.

  • Advanced Prototyping Optimization
  • Differential Pairs Flow Support
  • ODB++ teardrops import
  • Route Obstruct Areas
  • Manual Saw Tuning
  • Sequential Multi-part Floorplanning
  • Clearance Rules to NC Pins  …and more!


If you would like a preview of what’s new, please feel free to check out the What’s New in Xpedition IC Packaging VX.2.7 videos. Download this latest release from Support Center.

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/electronic-systems-design/2020/04/03/whats-new-in-xpedition-ic-packaging-design-for-vx-2-7/