What’s New in Xpedition® IC Packaging Design for VX 2.7
Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. They also deliver a complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling.
Here are some highlights of the Xpedition® VX. 2.7 IC Packaging design tools release.
- Advanced Prototyping Optimization
- Differential Pairs Flow Support
- ODB++ teardrops import
- Route Obstruct Areas
- Manual Saw Tuning
- Sequential Multi-part Floorplanning
- Clearance Rules to NC Pins …and more!
If you would like a preview of what’s new, please feel free to check out the What’s New in Xpedition IC Packaging VX.2.7 videos. Download this latest release from Support Center.