HDAP

New 3D IC Podcast Launch

January 31, 2022

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

By John McMillan
< 1 MIN READ
NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

August 23, 2021

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…

By John McMillan
2 MIN READ
What’s New in Xpedition® IC Packaging Design for VX 2.7

What’s New in Xpedition® IC Packaging Design for VX 2.7

April 3, 2020

Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB…

By John McMillan
< 1 MIN READ
Going to DAC’2017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!

Going to DAC’2017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!

May 26, 2017

If you’re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you…

By Keith Felton
< 1 MIN READ