Electronic Systems Design

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This blog is a place to learn about electronic systems design, from PCB design to simulation and verification, to manufacturability and manufacturing execution.

Learn more about electronic systems design.

Featured posts

An image of a PCB fabrication process

When design meets manufacturing: Why the digital thread and digital twin are leadership imperatives

December 22, 2025

When design and manufacturing operate without a cohesive digital twin, the consequences ripple across the enterprise.

By Stephen V. Chavez
4 MIN READ
Engineers working on PCB designs.

Optimizing multi-domain collaboration: turning engineering complexity into competitive advantage

December 8, 2025

Multi-domain collaboration is no longer a technical nice-to-have. It is a business imperative.

By Stephen V. Chavez
3 MIN READ
Icons for PCB components and design processes.

Top 5 benefits of Xpedition Standard

November 21, 2025

Xpedition Standard brings enterprise-level PCB design power into a flexible, approachable environment that evolves alongside your business.

By David Haboud
4 MIN READ

Latest posts

TESAT: Launching high-density space designs better and faster with stellar collaboration tools

March 23, 2022

Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…

By Danit Atar
2 MIN READ

Xpedition® VX.2.11 is now available for download!

March 22, 2022

Before you read on, a newer version of Xpedition is now available. To learn more, visit the VX.2.12 product highlights…

By John McMillan
< 1 MIN READ
Military Aviation

Global aerospace leader seamlessly integrates Valor NPI into an Allegro® workflow

March 18, 2022

Corporate Goal: reduce re-designs and increase product quality A few years ago corporate management at a global aerospace leader examined…

By Patrick Hope and Mark Forbes
5 MIN READ
PCB designers discussing stackup planning

You Need to Control Your PCB Stackups!

February 23, 2022

Z-planner Enterprise contains all the tools you need to design and verify stackups on fast PCB designs. In addition to being able to calculate impedance and design valid stackups, you can run the field solver and perform cross-section analysis. And, it includes the industry’s largest dielectric materials library, including laminates. The result is a stackup design that will produce first-time-right results regardless of the fabricator.

By Mark Forbes
3 MIN READ
Automated PCB assembly process

What is New Product Introduction (NPI) and How Does it Apply to PCBs?

February 2, 2022

The pace of PCB new product introductions has increased exponentially over the past few years – and with it the need for a proper NPI process. It’s not just that PCBs are used in more and more products across numerous industries; it’s also that more PCBs are needed in those products. For example, consider how many PCBs are used in even the lowest-end cars today versus how many were used years ago. As new-model cars become increasingly connected to online services, the need for PCBs will continue to grow.

By Patrick Hope
5 MIN READ
Connect for PADS Professional

CONNECT – For PADS Professional

February 1, 2022

Going beyond your desktop workspace and seamlessly collaborating with teammates and partners worldwide in a secure cloud environment just got…

By John McMillan
2 MIN READ

New 3D IC Podcast Launch

January 31, 2022

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

By John McMillan
< 1 MIN READ
PCB stackup with material and copper

PCB Stackup Design e-book

January 28, 2022

While not the final word on the subject of stackups, Bill’s e-book goes a long way to helping you plan ahead, providing an important voice in a space that is surprisingly lacking in content. I would also recommend exploring Z-planner Enterprise, a stackup tool that Bill has spent years developing. Now all you need is a sharp pencil.

By Patrick Hope
3 MIN READ

3D IC takes a village but must start with a netlist

January 18, 2022

In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…

By Tarek Ramadan
2 MIN READ