Two engineers working at their computers

Leveraging market-ready PCB design solutions for efficient design phases – Part 1: Understanding the time-to-market advantage

What if your design team could cut development time in half while improving product quality? In today’s fast-paced electronics industry, the ability to optimize time-to-market isn’t just convenient—it’s essential for survival and success. 

Closing the gap: How Manufacturing-Driven Design is transforming PCB engineering

Previously on episode 24 of the Printed Circuit Podcast, host Steph Chavez brought together two seasoned experts—Max Clark, Product Strategy…

Designing smarter, not harder: Embracing PCB design automation in PCB engineering

Previously on the premiere episode of Season 3 of the Printed Circuit Podcast, host Steph Chavez sat down with John…

PCB material selection for PCB stackup design

Avoid overspending on stackup materials in your PCBs – 8 high speed materials to consider

PCB material discussions are often focused around stackup material selection. These tend to be framed by questions like: ‘We use material ‘x’ for our designs and really like it. What do you think of it?’ This often veils the real question which is: ‘Do you know a good alternative to it?’

16 PCB experts to follow in 2025

Staying ahead in the fast-evolving world of PCB design means more than just following trends – it requires learning from…

3D of a PCB

PCB high voltage spacing: What every engineer should know

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.

Aerial view of agricultural silos.

Beyond silos: Enabling multidomain and multidiscipline integration in electronic systems design

Engineering success depends not just on deep expertise, but on seamless integration across domains and disciplines.

Icons of file folders

Design for manufacturing output files – optimizing engineering to manufacturing efficiency

As PCB design and manufacturing become increasingly complex, the choice of design for manufacturing output files plays a crucial role in streamlining processes, reducing errors, and improving time to market.

blind and buried vias

Blind and buried vias: An HDI technology

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.