Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido™ Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements. These milestones come after months of intensive collaboration to ensure designers have the tools they need to tackle the most challenging analog, mixed-signal, RF, and memory designs on TSMC’s cutting-edge process technologies. 

Analog FastSPICE Now Certified for TSMC N2P and A16 Processes 

AFS has achieved formal certification for TSMC’s leading-edge N2P and A16 processes. This certification delivers several key advantages to chip designers, including:

• Seamless integration into TSMC’s N2 custom design reference flow (CDRF), ensuring verified accuracy and performance
• Comprehensive support for TSMC’s Reliability Aware Simulation technology, enabling designers to address critical IC aging effects and real-time self-heating effects – crucial considerations at advanced nodes
• Enhanced compatibility with TSMC’s Compact Universal Photonic Engines (COUPE™) platform, opening new design possibilities for photonic integrated circuits
• Advanced variation-aware verification with Solido Design Environment software, fully integrated in the CDRF for TSMC’s N2P technology.   

Cloud-Ready for Enhanced Performance and Scalability

Both Solido SPICE and AFS are now certified for cloud deployment on AWS, as part of seven sign-off production flows that Siemens and TSMC have jointly verified. This certification enables customers to leverage cloud computing resources for their most demanding verification tasks, with the confidence that these tools will deliver the same exceptional accuracy and security they expect from on-premises deployments.

Impact for Design Teams

These certifications translate into concrete benefits for design teams:

• Minimized risk when implementing designs on TSMC’s most advanced process nodes 
• Accelerated time-to-market through faster verification and more efficient design iterations 
• Enhanced productivity via seamless integration with TSMC’s design flows and cloud deployment options 
• Improved reliability through early detection and mitigation of IC aging and self-heating effects

Mike Ellow, CEO of Siemens EDA, summarizes the significance of the continued Siemens EDA and TSMC collaboration: “As we continue to pioneer new solutions and redefine the possibilities within the semiconductor industry, our strategic alliance with TSMC remains a cornerstone of our strategy. These advances not only enhance our portfolio but also empower our mutual customers to meet the challenges of tomorrow.”

Ready to Learn More? 
Dive deeper into the Siemens and TSMC collaboration by reading the full press release here or explore how Solido SPICE, AFS, and the entire Solido Simulation Suite can accelerate your next advanced-node design project.