Solido Simulation Suite

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Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

April 23, 2026

Solido’s AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here’s what that means for designers working at advanced process nodes.

By Emma-Jane Crozier
3 MIN READ
Multi-die verification and the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

March 16, 2026

When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.

By Emma-Jane Crozier and Pradeep Thiagarajan
3 MIN READ

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA’s collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier
3 MIN READ

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier
3 MIN READ

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

By Emma-Jane Crozier
2 MIN READ