Industry: Electronics & Semiconductors

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Microchip’s journey to accelerated verification with Solido Additive Learning

May 8, 2026

Microchip leverages Solido Additive Learning’s AI-driven approach to accelerate iterative variation-aware verification by 3x to 20x, reducing re-verification cycles from weeks to hours.

By Jayne Alexander
3 MIN READ

Accelerating design innovation through scalable computing with cloud-ready Solido Simulation Suite on Amazon Web Services

May 8, 2026

Solido Simulation Suite on Amazon Web Services offers a cloud-ready solution to tackle the growing complexity of chip design by providing scalable, on-demand compute resources for efficient circuit simulation.

By Saurabh Kulkarni
2 MIN READ

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

April 23, 2026

Solido’s AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here’s what that means for designers working at advanced process nodes.

By Emma-Jane Crozier
3 MIN READ
Multi-die verification and the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

March 16, 2026

When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.

By Emma-Jane Crozier and Pradeep Thiagarajan
3 MIN READ

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia
3 MIN READ

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA’s collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier
3 MIN READ
Agentic IC design panel discussion at Solido Custom IC Forum

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

November 26, 2025

Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.

By Emma-Jane Crozier
3 MIN READ
Solido Custom IC at GTS 2025

Solido Custom IC at GTS 2025

September 23, 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August…

By Mohamed Atoua
2 MIN READ

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

August 29, 2025

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

By Emma-Jane Crozier
3 MIN READ