Industry: Electronics & Semiconductors

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Library characterization takes too long – here’s how Solido Characterizer uses AI to change that

June 12, 2026

Tired of library characterization taking weeks? Solido Characterizer uses AI to slash runtime to days, boosting throughput by 7x with predictive, generative and agentic AI.

By Emma-Jane Crozier
5 MIN READ

Introducing Custom IC Design Tool Tips: a new YouTube series for S-Edit and L-Edit users

June 5, 2026

The CICD team has launched Tool Tips! A YouTube series of short, practical walkthroughs for engineers working with S-Edit and L-Edit.

By Mamoona Ahmad
3 MIN READ

How NVIDIA is scaling Liberty verification for diverse IP using the Solido Characterization Suite

June 1, 2026

NVIDIA scales Liberty verification for diverse IP using Solido Characterization Suite, tackling challenges like diverse IP, consistency, and scalability for improved silicon quality.

By siddharth ravikumar
4 MIN READ

Chiplet Summit 2026: Solido Simulation Suite tackles the verification complexities of 3D IC design

May 29, 2026

Solido Simulation Suite excels at Chiplet Summit 2026, tackling 3D IC verification complexities with SPICE-level accuracy for chiplet workflows.

By Lih-Jen Hou
3 MIN READ

Microchip’s journey to accelerated verification with Solido Additive Learning

May 8, 2026

Microchip leverages Solido Additive Learning’s AI-driven approach to accelerate iterative variation-aware verification by 3x to 20x, reducing re-verification cycles from weeks to hours.

By Jayne Alexander
3 MIN READ

Accelerating design innovation through scalable computing with cloud-ready Solido Simulation Suite on Amazon Web Services

May 8, 2026

Solido Simulation Suite on Amazon Web Services offers a cloud-ready solution to tackle the growing complexity of chip design by providing scalable, on-demand compute resources for efficient circuit simulation.

By Saurabh Kulkarni
2 MIN READ

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

April 23, 2026

Solido’s AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here’s what that means for designers working at advanced process nodes.

By Emma-Jane Crozier
3 MIN READ
Multi-die verification and the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

March 16, 2026

When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.

By Emma-Jane Crozier and Pradeep Thiagarajan
3 MIN READ

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia
3 MIN READ