Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

Heading to DAC 2025 with Microsoft: Novel TRNG Verification with a High-Performance Simulation Methodology

In our data-driven world, the need for robust security solutions continues to grow. At the heart of modern cryptographic systems…

Transform Your IP Selection Process with Solido Library Profiler

At the heart of every breakthrough technology lies intellectual property (IP), powering everything from cutting-edge System-on-Chips (SoCs) to specialized Application-Specific…

How Crystal Oscillators Keep the Semiconductor Industry in Tune ♫

A crystal oscillator (XO) can be thought of as a musical instrument that produces a pure and constant tone. The…

Quantum semiconductor research forges ahead with steady breakthroughs

Quantum computing is an emerging technology Quantum computing promises a new generation of high-performance computers, with a completely novel approach…

‘SPICE up’ your Verification this holiday season!

Just as I wrapped up my fancy Thanksgiving cooking marathon, I couldn’t help but draw parallels between the meticulous artistry…

Do you hear me now?

Siemens Symphony platform accelerates mixed-signal verification of DSP chips

Next-generation RF, ESD and IO designs on display at TSMC 2023 OIP Ecosystem Forum

TSMC 2023 Open Innovation Platform® Ecosystem Forum is taking a world stage in North America, Europe, Taiwan, China, Israel and…