Emma-Jane Crozier

Emma-Jane Crozier is a Product Marketing Manager at Siemens EDA for Solido Custom IC products. With extensive experience in B2B marketing within the semiconductor industry, she develops strategic content and messaging that drives product adoption and customer engagement.

Self-verifying, long-running EDA AI agents that engineers can trust

Self-verifying, long-running EDA AI agents that engineers can trust

July 29, 2026
At DAC 2026, we announced self-verifying, long-running EDA AI agents for semiconductor and PCB design, in collaboration with NVIDIA.
By Emma-Jane Crozier
< 1 MIN READ
AI in EDA: Practical advice, no matter where you are on the journey

AI in EDA: Practical advice, no matter where you are on the journey

July 8, 2026
Curious about AI in EDA? Discover how to seamlessly integrate AI by pinpointing problems, testing incrementally, collaborating with vendors and measuring impact.
By Emma-Jane Crozier
< 1 MIN READ
Library characterization takes too long – here's how Solido Characterizer uses AI to change that

Library characterization takes too long – here's how Solido Characterizer uses AI to change that

June 12, 2026
Discover how Solido Characterizer uses AI to deliver 7x faster library characterization — turning weeks of runtime into days without sacrificing accuracy.
By Emma-Jane Crozier
< 1 MIN READ
Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

April 23, 2026
Solido's AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here's what that means for designers working at advanced process nodes.
By Emma-Jane Crozier
< 1 MIN READ
What to expect at the Solido Custom IC track at User2User North America 2026

What to expect at the Solido Custom IC track at User2User North America 2026

April 22, 2026
Intel, NVIDIA, Microsoft, and STMicroelectronics will be sharing their real-world experiences using AI-powered Solido tools for custom IC design.
By Emma-Jane Crozier
< 1 MIN READ
Multi-die verification: the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

March 16, 2026
When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.
By Emma-Jane Crozier
< 1 MIN READ
Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

December 23, 2025
From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA's collaboration eliminates one of the biggest roadblocks in hardware security verification.
By Emma-Jane Crozier
< 1 MIN READ
Is Agentic IC Design the Next Big Thing? Industry Experts Answer

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

November 26, 2025
Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.
By Emma-Jane Crozier
< 1 MIN READ
Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

August 29, 2025
From rapid library generation to precise analytics, Google and Siemens EDA's latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.
By Emma-Jane Crozier
< 1 MIN READ
Meet the Solido Custom IC Team at DAC 2025

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025
The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.
By Emma-Jane Crozier
< 1 MIN READ
Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025
After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.
By Emma-Jane Crozier
< 1 MIN READ