Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis
Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software category. This honor, decided by a panel of AspenCore’s senior industry analysts alongside an international community of electronics professionals, celebrates the importance of Calibre 3DThermal in enabling the next generation of advanced semiconductors. Calibre 3DThermal was publicly released in June 2024 and has garnered attention and accolades since its debut.
Binson Chen and Alex Hung accepted the award on behalf of the Calibre group at the Four Seasons Hotel in Shenzhen, where industry leaders gathered to celebrate excellence in innovation. This accolade highlights Siemens’ role as a leader in electronic design automation (EDA) and underscores Calibre 3DThermal’s unique position within the 3D IC design landscape.
Calibre 3DThermal: Enabling inside-package 3D IC thermal analysis
Calibre 3DThermal delivers a specialized solution for addressing one of the most critical challenges in 3D integrated circuit (3D IC) design—effective thermal analysis, debug and sign-off verification. As 3D IC technology advances, designers require robust tools to manage the significant thermal implications that come with increased circuit density. Calibre 3DThermal enables chip designers to tackle these issues from the outset of package design continuing through sign-off verification, ensuring more reliable designs and minimizing the need for costly rework at later stages.
Here are three standout features of Calibre 3DThermal that have captured the attention of industry experts:
- Comprehensive IC-to-System thermal modeling
- Accurate, efficient thermal verification
- Integration with Siemens’ simulation solutions
Download the full technical paper to discover how Calibre 3DThermal can support your 3D IC designs, Conquer 3D IC thermal impacts with Calibre 3DThermal.
Supporting the next era of 3D ICs
As the 3D IC market accelerates—expected to grow by more than 15% annually through 2031—solutions like Calibre 3DThermal are pivotal to advancing design capabilities in this space. The tool’s powerful thermal modeling and verification capabilities will empower designers to push the boundaries of 3D ICs, allowing for faster, more successful development cycles. By addressing thermal challenges at every stage, Calibre 3DThermal helps foster a future where 3D ICs can achieve higher performance, efficiency, and reliability.
Calibre 3DThermal is the first tool in a suite of multiphysics analysis tools for 3D ICs from the Siemens EDA. The Calibre 3D IC platform ensures fast and accurate DRC, LVS, extraction and reliability verification for the most advanced 3D ICs.
Conclusion: Shaping the Future of Electronics Design
Receiving the AspenCore WEAA award is a remarkable achievement for Siemens Digital Industries Software and a testament to the value of Calibre 3DThermal in the evolving electronics landscape. As 3D IC designs continue to drive the next wave of semiconductor innovation, Calibre 3DThermal stands ready to support designers in overcoming complex thermal challenges.
For more information, visit the Calibre 3DThermal webpage.
