In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is…
Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative…
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a…
The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the…
Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on…
I put the title in quotes as it’s the title of a blog post by John Chawner at Pointwise who…
From a software user’s perspective it really doesn’t matter exactly how that application was developed. A user is concerned with…
It has been almost 3 years since I started this blog and I hope you’ve found it as interesting as…
In 1989 Flomerics was the first organisation to provide application specific CFD based simulation software where all pre and post-processing…
