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What’s new in IC Packaging 2409

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for heterogeneous integration prototyping and floorplanning of advanced 2.5/3D package assemblies. At the forefront of this release is Innovator3D IC, which  delivers the fastest and most predictable path for planning and heterogeneous integration of ASICs and chiplets using the latest semiconductor packaging 2.5D & 3D technology platforms and substrates.

But that’s not all—this release also brings a significant overhaul to the Xpedition Package Designer (xPD) user experience, along with a suite of enhanced capabilities that streamline design processes and boost productivity.

To learn more about Innovator3D IC visit our website.

Let’s now delve into the key features of Xpedition Package Designer in the 2409 release that are set to redefine how designers approach semiconductor packaging.

Modern user experience

One of the standout features of 2409 is its modern user experience. We’ve tackled the complexity of design by introducing an adaptive and agile interface that significantly lowers learning curves. By focusing on ease-of-use and a unified user experience, engineers can now work more efficiently, accelerate their design processes, and enjoy a more satisfying experience overall.

Pad entry enhancements

One of the most noteworthy updates in this release is the pad entry enhancements. These improvements focus on optimizing the connection paths for signal and power routing within the package design. The enhancements offer designers greater control over pad entry angles and alignment, which is crucial for minimizing signal interference and improving overall electrical performance. The ability to fine-tune these entry points allows for more precise routing, leading to a more reliable and efficient package design.

Popup bar

The new popup bar feature is all about convenience and efficiency. It introduces a context-sensitive toolset that dynamically appears based on the designer’s current actions. Whether you’re routing traces, placing components, or adjusting pad entries, the popup bar provides quick access to the most relevant tools, significantly speeding up the design process. This feature reduces the need to navigate through multiple menus, allowing designers to focus on their work without unnecessary interruptions.

Physical reuse

The physical reuse capability has been enhanced in the 2409 release to further streamline the design process. Physical reuse allows designers to replicate complex design elements across multiple projects or within different sections of the same project. This feature is particularly useful for maintaining consistency and reducing design time. With the latest updates, physical reuse is more flexible and easier to implement, enabling designers to quickly and accurately replicate design patterns and layouts across different package assemblies.

Enhanced physical reuse equivalency

Building on the physical reuse feature, enhanced physical reuse equivalency provides additional layers of consistency and control. This enhancement ensures that reused design elements maintain their equivalency, meaning that any changes made to the original design are automatically reflected in all reused instances. This not only saves time but also ensures that design standards and specifications are adhered to across all instances of reuse, reducing the risk of errors and inconsistencies.

Layer mapping enhancements

Managing layer information is a critical aspect of complex package design, and the layer mapping enhancements in this release make it easier than ever. These enhancements provide improved tools for mapping and managing layer information across different package assemblies. Designers can now map layers more intuitively, ensuring that all components and connections are accurately represented in the final design. This is especially important for advanced 2.5/3D packaging, where accurate layer mapping is crucial for ensuring the integrity and performance of the package.

Simplified auto route UX

Routing is a fundamental part of package design, and the 2409 release introduces a simplified auto route user experience (UX) that makes this task more intuitive and efficient. The new auto-routing capabilities are designed to simplify the process of routing signals and power through the package. The user interface has been streamlined to provide clearer, more accessible routing options, enabling designers to achieve optimal routing with minimal manual intervention. This results in faster design cycles and more reliable routing outcomes.

Group stretch for lines

Finally, the group stretch for lines feature is a powerful tool for adjusting multiple lines simultaneously within a design. This feature allows designers to select and modify groups of lines, stretching or compressing them as needed to fit the design requirements. This is particularly useful for making large-scale adjustments to routing paths or component placements, ensuring that all elements of the design fit together seamlessly without the need for individual line adjustments.

Download the 2409 release

The 2409 release marks a significant step forward for Xpedition Package Designer, bringing a host of new features and enhancements that streamline the design process, improve accuracy, and boost productivity. From advanced routing capabilities to enhanced design reuse, these updates empower designers to tackle the complexities of modern semiconductor packaging with greater ease and confidence.

Explore these new features today and see how 2409 can take your design processes to the next level.

Keith Felton

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/semiconductor-packaging/2024/09/19/whats-new-in-ic-packaging-2409/