Products

Migrating to the cloud for intelligent SoC verification

Are you tired of dealing with limited on-premises compute resources and competing for compute resources to launch your critical design...

By Nebabie Kebebew

Tessent Solutions

Event: Tessent 2023 DFT Tech Forum

Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.

By Tessent Solutions

EDA innovation at its finest display in the Pacific Rim

In continuation to my earlier blog on Semiconductor renaissance in the making, it is essential that foundries, IC design and...

By Pradeep Thiagarajan

NX for Students | Enhancing Future Employability and Getting NX Certified

As a student engineer or designer, we are filled with creative ideas. Learning NX as a tool for all stages of your design process can help you bring these ideas to life, during university, and beyond with a single software.

By eilidh.dickerson

Electronic Systems Design

What’s new in PADS Professional release VX.2.13

The new VX.2.13 release of PADS Professional has improvements for the following features in PADS Professional layout. Enhancements to the...

Semiconductor Packaging

What’s new in Xpedition IC Packaging release VX.2.13

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which...

By Keith Felton

Electronic Systems Design

What’s new in Xpedition Enterprise release VX.2.13

The new VX.2.13 release of Xpedition has improvements across three key areas: Layout, data management, and verification. Improvements in Layout...

Electronic Systems Design

What’s new in HyperLynx release VX.2.13

The new VX.2.13 release of HyperLynx delivers state of the art simulation capabilities to mainstream designers by combining advanced modeling...

By Todd Westerhoff

Simplify Assembly | Part Two | Tips and Tricks

We’re back with another entry into our latest NX™ software Tips and Tricks. We’re taking a closer look at the...