3D IC package design flows – ep. 3

3D IC package design flows

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In most cases, it’s very expensive to get game-changing technological advancements in electrical components to the market. This is because they also require the advancement of the existing design workflows and tools. This barrier has slowed down and even completely stopped the possible mass production of many revolutionary devices. 3D IC is not exempt from this challenge – that’s why several large companies have invested heavily in the development of new package design flows and tools to handle it.

In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He will help us understand the necessary design flow changes needed to make 3D IC  a reality.

You will learn the differences between traditional semiconductor packaging and 3D IC packaging. Also, you will hear about the design workflow required to successfully build 3D IC-based devices. Additionally, gain insight into the new tools that are required to successfully create and test such devices.

What You Will Learn in this Episode:

  • The difference between 3D IC and traditional semiconductor packaging (01:37)
  • Why 3D IC requires a change in package design flows (03:28)
  • The workflows envisioned for 3D IC (05:57)
  • The new tools required to handle the new workflows (07:47)
  • The most critical 3D IC workflows (11:13)
Tony Mastroianni

Tony Mastroianni

Advanced Packaging Solutions Director at Siemens Digital Industries Software

John McMillan

John McMillan

Marketing Manager at Siemens Digital Industries Software


Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing, and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities, and levels of automation to drive innovation.

For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedInTwitterFacebook and Instagram.

Siemens Digital Industries Software – where today meets tomorrow.

3D IC Podcast

3D IC

Three-dimensional integrated circuits take less space and deliver higher performance.

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