Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

Electronic Systems Design

What's new in Valor 2604

The latest release of Valor NPI 2604 continues to strengthen our Design-For-Manufacturing (DFM) validation by bringing new constraint types, additional checks and enhanced analysis capabilities.

By Patrick Hope

Electronic Systems Design

What's new in Xpedition 2604

The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.

Electronic Systems Design

What's new in HyperLynx 2604

HyperLynx 2604 release brings a comprehensive set of enhancements that make PCB design verification faster, more intelligent, and more accessible

By Sajeda Tamimi

Semiconductor Packaging

What's new in Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

NEW RELEASE: Simcenter HEEDS Connect 2604

Simcenter HEEDS Connect 2604 is here, and it's packed with powerful enhancements designed to help engineering teams collaborate seamlessly, explore possibilities together, and make more confident design decisions in real-time, online.

By Hunor Erdelyi, Roberto D'Ippolito

Simcenter HEEDS 2604: Modernized design optimization with AI surrogates, streamlined resource management and enhanced simulation integration

This blog outlines how the latest release from Simcenter HEEDS 2604 accelerates design optimization workflows for engineers working with high...

By Roberto D'Ippolito, Hunor Erdelyi

AWS Partnership

A first for Siemens and AWS – a successful live broadcast at CES 2026!

If you attended this year’s CES you witnessed history in the making. With everything AI these days, no question there...

By Scott Salzwedel

Semiconductor Packaging

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory

HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...

Latest podcast episodes

The Industry Forward Podcast

Flexible automation powered by AI

Humanoid robots bring humanlike flexibility while not being limited by human anatomy.

The Industry Forward Podcast

The 5 best FAIR data secrets to empower process engineers

Learn the five secrets of FAIR data and how it will herald the next industrial revolution through digital twins, AI and simulation.

By Shawn Wasserman

The Industry Forward Podcast

Shifting left: How Makersite and Siemens enable sustainability by design

The concept of “shifting left” is especially critical for the development of sustainable products. The sooner companies have insights into...

By Quinn Foster