Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Semiconductor Packaging

The impact of 3d heterogeneous integration on semiconductor device reliability

December 08, 2022

So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance...

By Heather George

Siemens Software Podcast Network

AI Spectrum – Simplifying Simulation with AI Technology Part 3

December 08, 2022

AI is not only empowering tools to function with greater efficiency and usability, but it’s also helping spearhead the next...

By Spencer Acain

Siemens Xcelerator Software for Industry

How digitalization in the automotive industry benefits manufacturers

December 08, 2022

In our previous blog How software/hardware integration helps automakers build tomorrow’s vehicles, we discussed the challenges of managing complexity as...

By Steve Hartman

Siemens Software Podcast Network

Bringing Sustainability and Privacy to Autonomous Ride-Sharing with Felix Andlauer - Part 2

December 08, 2022

Autonomous vehicle (AV) design is complex, to say the least… Follow us on: iTunes Google Podcasts Spotify Stitcher TuneIn RSS...

By Ed Bernardon

Academic and Future Workforce

Hanyang University student team won 2nd place in Korean SAE Competitions using Simcenter STAR-CCM+ and NX

December 07, 2022

After winning 3rd place in 2021, the Siemens-supported student competition team, Baqu4 of Hanyang University-Erica Campus, received 2nd place in...

By youheng.dong

You've been accepted into Partner Academy

December 07, 2022

Congratulations, and welcome to Siemens Partner Academy! You are now part of a world-class program that provides limitless opportunities for...

By Robert Lyons

Seasonal robotic simulation: tree decoration and gift wrapping

December 07, 2022

For many people, wrapping a gift or decorating a tree is part of the holiday season joy. But for others...

By Ambroise Confetti

Calibre IC Design & Manufacturing

Infineon and Siemens collaborate for innovation

December 06, 2022

By Karen Chow When Infineon needed to select a field solver for the development of their next-generation power semiconductor products,...

By Calibre IC Design & Manufacturing

Expedite your artwork process with Teamcenter

December 06, 2022

Ready to enhance your label-making process? Create labels the "right way" in days compared to weeks. Close the gaps necessary to an automated process with Teamcenter.

By Michael Alexander

Latest podcast episodes

Understanding AI-assisted Chip Design

January 23, 2026

Chip design is one of the most complex and challenging tasks in the world, requiring specialized tools and knowledge far...

By Spencer Acain

Engineering the Future Workforce

How Arizona State University is redefining education and lifelong learning through microcredentials

January 05, 2026

Stackable microcredentials are emerging as an essential tool for closing the talent gap at the speed of industrial change.

Driving the adoption of generative AI in industry

January 02, 2026

New technology can offer a lot of promise for improving on long-standing techniques or developing innovative approaches to different challenges...

By Spencer Acain