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Electronic Systems Design
What's new in Xpedition 2604
April 27, 2026
The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.
By David Wiens
4
MIN READ
Electronic Systems Design
What's new in HyperLynx 2604
April 27, 2026
HyperLynx 2604 release brings a comprehensive set of enhancements that make PCB design verification faster, more intelligent, and more accessible
By Sajeda Tamimi
4
MIN READ
Semiconductor Packaging
What's new in Innovator3D IC 2604
April 27, 2026
This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.
By Keith Felton
2
MIN READ
Simcenter
NEW RELEASE: Simcenter HEEDS Connect 2604
April 27, 2026
Simcenter HEEDS Connect 2604 is here, and it's packed with powerful enhancements designed to help engineering teams collaborate seamlessly, explore possibilities together, and make more confident design decisions in real-time, online.
By Hunor Erdelyi, Roberto D'Ippolito
5
MIN READ
Simcenter
Simcenter HEEDS 2604: Modernized design optimization with AI surrogates, streamlined resource management and enhanced simulation integration
April 27, 2026
This blog outlines how the latest release from Simcenter HEEDS 2604 accelerates design optimization workflows for engineers working with high...
By Roberto D'Ippolito, Hunor Erdelyi
5
MIN READ
AWS Partnership
A first for Siemens and AWS – a successful live broadcast at CES 2026!
April 26, 2026
If you attended this year’s CES you witnessed history in the making. With everything AI these days, no question there...
By Scott Salzwedel
11
MIN READ
Semiconductor Packaging
HBM3e and HBM4: IC design guide for next-generation high bandwidth memory
April 24, 2026
HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...
By Emily Yan
8
MIN READ
Siemens Software Podcast Network
The 5 best FAIR data secrets to empower process engineers
April 24, 2026
Learn the five secrets of FAIR data and how it will herald the next industrial revolution through digital twins, AI and simulation.
By Shawn Wasserman
< 1
MIN READ
Thought Leadership
Shifting left: How Makersite and Siemens enable sustainability by design - Transcript
April 24, 2026
In this episode of The Industry Forward Podcast, Eryn Devola and Neil D’Souza talk about the partnership between Siemens and...
By Quinn Foster
10
MIN READ
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Latest podcast episodes
The Industry Forward Podcast
Get with the program: Industrial AI won't suddenly vaporize
July 29, 2026
Those clinging to the ways before industrial AI will be left behind.
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3D IC
Beyond the silo: Managing data at the speed of 3D IC design
July 29, 2026
PLM manages product-level changes — things like ideation, supply chain, manufacturing, and demand. IPLM, on the other hand, is designed...
By Tova Levy
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The Industry Forward Podcast
Powering the future of humanoid robotics
July 24, 2026
Humanoid robots must operate untethered and move freely in factories, making battery performance essential. To make humanoids practical for large-scale...
By Bianca Ward
< 1
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