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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry

Semiconductor Packaging

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025
What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a...
By John McMillan
14 MIN READ
Opcenter

What’s new in Opcenter APS 2504

May 19, 2025
Welcome to the latest update for Opcenter™ Advanced Planning and Scheduling (APS) – version 2504! This release brings a range...
By Axel Regnet
4 MIN READ
Polarion

Polarion X – What’s New and Noteworthy

May 16, 2025
Polarion X 2410 our latest SaaS release that builds upon the foundation of Polarion ALM 2410. Learn more in our blog!
By Jean-François Thibeault
5 MIN READ
Opcenter

Join our quality management sessions at Realize LIVE Americas 2025

May 15, 2025
Ready to revolutionize your quality management processes? Don’t miss the digital transformation conference designed for professionals in engineering, manufacturing, product...
By Valentina Lupo
5 MIN READ
Siemens Software Podcast Network

The future of 3D ICs: How advanced packaging is changing the industry

May 15, 2025
How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this...
By Tova Levy
< 1 MIN READ
Custom IC

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025
After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.
By Emma-Jane Crozier
2 MIN READ
Semiconductor Packaging

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

May 11, 2025
Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing...
By Tova Levy
< 1 MIN READ
Designcenter

What's New In NX | Model-Based Definition and NX Inspector

May 08, 2025
Robust model-based definition (MBD) is vital for connecting the digital thread between design and manufacturing. The mature MBD capabilities in...
By Michael Hobson
4 MIN READ
Digital Logistics

Integrated. Orchestrated. Sustainable. See what’s next at transport logistic 2025

May 07, 2025
From JUNE 2-5, the global logistics industry comes together in Munich for one of the most important trade fairs of...
By yasmin.gensmantel
2 MIN READ

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