Log in
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • Additive Manufacturing Software
    • Aprisa
    • Calibre IC Design & Manufacturing
    • Capital
    • Catchbook
    • Custom IC
    • Designcenter
    • Designcenter Solid Edge
    • Digital Design Creation Platform
    • Digital Logistics
    • EDA Consulting Services
    • Electronic Systems Design
    • Fibersim
    • Hardware Assisted Verification
    • HLS Design & Verification Blog
    • HPCWorks
    • Insights Hub
    • JT
    • Mendix
    • NX Manufacturing
    • Opcenter
    • Pave360
    • PLM Components
    • Polarion
    • Questa
    • Rapidminer
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
  • Industries
    • All Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • Additive Manufacturing Podcast
    • AI Spectrum
    • Bugged Out
    • Cloud Talk Today
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Empowering Engineering Educators
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Engineering the Future Workforce
    • Model Based Matters
    • Next Generation Design Podcast
    • On the Move: A Siemens Automotive Podcast
    • Pioneers: Startups from Dreams to Reality
    • Printed Circuit Podcast
    • Security by Design
    • Talking Aerospace Today Podcast
    • The Battery Podcast
    • The Digital Dig - A Siemens Heavy Equipment Podcast
    • The Industry Forward Podcast
    • The Marine Industry Podcast Series
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
    • German only Podcasts
    • Machinenbau Talk
  • Thought Leadership
    • All Thought Leadership
    • Digital Transformation
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • The Art of the Possible
    • Thought Leadership
    • Verification Horizons
  • Corporate
    • All Corporate
    • Academic and Future Workforce
    • AWS Partnership
    • Corporate Blog
    • Cre8Ventures (Siemens EDA)
    • EDA Support Blogs
    • Employee Spotlight
    • eXplore tour
    • Partners
    • Realize LIVE
    • Siemens Xcelerator Academy
    • Siemens Xcelerator Software for Industry
    • Small & Medium Business
    • Xcelerator for Startups Videos
  • Community
  1. Home
  2. Industries

Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Simcenter

Unlock testing excellence: Your monthly Simcenter physical testing update | July 2026

July 14, 2026
Discover the latest news from Simcenter Physical Testing that are transforming the way engineers approach testing. Check back regularly as we continuously update this blog with the freshest Simcenter Physical Testing news, tips, and insights.
By Mathieu Sarrazin
33 MIN READ

Custom IC

How agentic AI is shaping the future of custom IC design and verification: Solido at DAC 2026

July 10, 2026
Join the Solido team at DAC 2026 and explore the latest in agentic AI-powered custom IC design and verification, featuring interactive demos and expert sessions not to be missed.
By Mamoona Ahmad
4 MIN READ

Opcenter

Introducing MapSuite for Opcenter Execution Semiconductor: Precision Substrate Map Management

July 10, 2026
In a semiconductor fab, data moves as fast as the product does. Substrate maps, the digital fingerprints of every wafer,...
By Alessandro Cereseto
3 MIN READ

Custom IC

Maximizing the capabilities of Siemens’ L-Edit for Custom IC Layout

July 09, 2026
Solido Custom IC Design team shares L-Edit tips: Flylines, Highlight Connected and Calibre Real Time for efficient layout.
By John Peloso
2 MIN READ

Custom IC

AI in EDA: Practical advice, no matter where you are on the journey

July 08, 2026
Curious about AI in EDA? Discover how to seamlessly integrate AI by pinpointing problems, testing incrementally, collaborating with vendors and measuring impact.
By Emma-Jane Crozier
4 MIN READ

Siemens Software Podcast Network

The hidden time bomb: Engineering reliability into 3D IC from day one

July 08, 2026
“Do not treat reliability as an afterthought, something which you just do at the very end of the design process,...
By Tova Levy
2 MIN READ

Simcenter

Accurate material model calibration for CAE: Introducing Simcenter Material Modeler 2026.0

July 02, 2026
Discover how your material modeling workflow transforms - from test data to simulation-ready material cards, faster and accurately with Simcenter Material Modeler
By Nachiket Patil
9 MIN READ

NX Manufacturing

Siemens and Microsoft: AI-powered manufacturing of humanoid components

July 01, 2026
At Hannover Messe 2026, as part of our strategic partnership with Microsoft, Siemens played a pivotal role in the technology display...
By Ashley Eckhoff
2 MIN READ

Siemens Software Podcast Network

Zero trust in silicon: The new security imperative for chiplet-based 3D ICs

July 01, 2026
“You don’t just say, the other chiplet that’s on this die, I’m going to trust it, it’s fine. No —...
By Tova Levy
2 MIN READ

Posts navigation

  • «
  • 1
  • 2
  • 3
  • 4
  • …
  • 107
  • »