Speakers Gabriella Leone and Michael Munsey

Collaboration: The key to semiconductor industry growth and resilience | Executive strategy deep-dive- Part 1

In this two-part Q&A interview series, we sit down with Michael Munsey, Vice President of Semiconductors and Electronics at Siemens Digital Industries Software. Michael shares his insights on Siemens’ forward-thinking three-pillar strategy, designed to position the company as a key enabler of semiconductor industry growth through greater collaboration, software-driven innovation, and digital transformation.

Digital transformation in electronics

Accelerate digital transformation in electronics 

Explore the five essential steps to drive digital transformation in your electronics business with our compelling eBook

The Multiplier Effect

Evolve from lean to smart manufacturing to optimize production without disrupting lean processes

The time for change is now. While many semiconductor companies have relied on lean manufacturing techniques for decades, smart solutions…

Semiconductor and electronics industry trends 2025: Expert analysis and market outlook

As we approach the end of 2024, I find myself reflecting on the remarkable transformation our industry has undergone. From…

Semiconductor Lifecycle Management

With faster NPI and APQP, chipmakers can accelerate product development and elevate quality

In a survey* of semiconductor industry executives, leaders say that time-to-market is now one of the top items keeping them…

Engineer’s Corner: Real-world BOM challenges

Navigating product variability in consumer electronics In today’s fast-paced electronics industry, managing Bills of Materials (BOMs) for products with multiple…

The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

An engineer is working at a computer workstation with multiple monitors displaying electronic system designs and schematics. The title above the image reads "Electronic systems design: Blog series - Part 2 Accelerating mechanical and electrical design".

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

A lush green forest with a blue river running through it.

Smart is Sustainable.  

A world in critical need of a sustainable future needs smart manufacturing for semiconductors.