Real solutions, real results, smart manufacturing for electronics innovation today!

By Maria Mosto

As we rely more heavily on electronic devices in our daily lives, we see them becoming more complex, highly customized, and innovative. Producing these types of devices today requires an entirely different, holistic approach.

Managing PCB production and box-build (assembly) as a holistic, end-to-end process provides manufacturers with the opportunity to boost efficiency and shorten time-to-market. But how do manufacturers adapt and build a smart and agile end-to-end manufacturing process? What tools do they need to make it work? Watch the webinar “Building the infrastructure for holistic, end-to-end manufacturing” to learn more.

What’s getting in the way of production efficiency?

Let’s start by looking at the interplay between the mechanical and electronic domains. Historically, companies that build printed circuit boards (PCBs) focus on the electronic and electromechanical production aspects separately. Too often, mechanical design changes don’t consider electronic characteristics and vice versa. And it continually creates problems like more manufacturing defects, engineering change orders (ECOs), and bottlenecks, which slow down the entire production process.

Optimizing the production resources you already have

As the saying goes, time is money. The more you can squeeze out of your production lines, the more money you make, right? But if you’ve been struggling with improving production or even if everything is going fine, it’s possible to increase throughput by just reorganizing the way you work. The key is to have the visibility to make all your operations run as smoothly and seamlessly as possible.

View the animated video to learn more.

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This article first appeared on the Siemens Digital Industries Software blog at