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Siemens EDA achieves compliance with rail standards

Siemens EDA is committed to meeting qualification and compliance criteria as defined by rail industry standards. After getting a full…

Built-in Security Equals Peace of Mind

The cybersecurity landscape continues to rapidly evolve, with resultant vulnerabilities too often headline news. Who can forget Log4j? Facing this…

What’s New in Xpedition IC Packaging-VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package…

TESAT: Launching high-density space designs better and faster with stellar collaboration tools

Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…

Connect for PADS Professional

CONNECT – For PADS Professional

Going beyond your desktop workspace and seamlessly collaborating with teammates and partners worldwide in a secure cloud environment just got…

New 3D IC Podcast Launch

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

3D IC takes a village but must start with a netlist

In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…

Stoneridge: Addressing Digital Transformation with Xpedition Enterprise

Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…