The cybersecurity landscape continues to rapidly evolve, with resultant vulnerabilities too often headline news. Who can forget Log4j? Facing this…
Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package…
Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…
Going beyond your desktop workspace and seamlessly collaborating with teammates and partners worldwide in a secure cloud environment just got…
NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…
In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…
Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…
Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…
Check out what’s new in the latest VX.2.8 release of HyperLynx – the industry’s complete family of analysis tools for…
