Get ready to accelerate: IESF Munich event is for automotive innovators

By Sarah Bartash

Explore the challenges facing electrical and electronic (E/E) design engineers and their teams at the Integrated Electrical Solutions Forum (IESF)! IESF Munich is the one day event you can’t miss. It takes place Thursday 30 November, 2023 at the Munich Airport Hilton in Munich, German. Gain visibility into key automotive trends and design solutions for digital transformation and expand your proficiency and perspective.

REGISTER NOW and bring your whole team to this FREE event! Attendance is complimentary and includes a breakfast, lunch, and evening cocktail reception in the expo.

IESF is a long-standing series of events that take place all over the world and bring together the global automotive engineering community with a special focus on electrical and electronic systems. The first event was in Frankfurt, Germany in 2000. This years, the conference promises a variety of topics such as Embedded Systems, Network Design, Electronic Design Automation (EDA), MCAD/ECAD, PLM, PCB Systems Design, MBSE and Digital Transformation.

Read on to see who is presenting this year!

1. Brian Campe

Industry Keynote: Engineering champions–Driving performance together

Brian Campe, Technical Director –
Hendrick Motorsports

Since 1984, Hendrick Motorsports has earned a record 14 car owner championships in NASCAR’s premier division. The organization fields four full-time Chevrolet teams on the NASCAR Cup Series circuit with drivers Kyle Larson, Chase Elliott, William Byron and Alex Bowman.
Future of Mobility

Nand Kochhar, VP, Automotive and
Transportation Industry – Siemens Digital Industries Software

A transformation is taking place in the automotive industry as companies work to deliver on the trends of autonomy, electrification and connected vehicles. This presentation will address what companies need as they embark on this transformation. It will also explore how Siemens is uniquely positioned across the entire the SDV digital thread with connected virtual engineering capabilities and powerful solutions across the electronics, electrical, networks, and software domains as well as the vehicle integration and its interactions with the driving environment.
image of frances evans Transformative E/E Systems Development for Software-defined Vehicles

Frances Evans, Senior Vice President – Integrated Electrical Systems, Siemens Digital Industries Software

Doug Burcicki, Senior Director – Automotive & Heavy Equipment, Siemens Digital Industries Software
Join us and learn how to accelerate the development of E/E systems that differentiate the world’s most sophisticated products. Hear stories from real-world customers who are being successful today.  Whether you want to lead in electrical, discover a better way to develop embedded software, or learn how to integrate across E/E systems and adjacent engineering domains, we can help you succeed.  Discover the breadth and depth of the Capital portfolio and how it can help you more effectively develop E/E systems today!
Bryan Horvat
Enabling E/E system electrification with modern day tools and flexibility, a Rivian perspectivey

Bryan Horvat, Staff Electrical Integration Engineer, Rivian

Siemens Capital’s flexibility allows it to be launched and utilized efficiently by different types of users at a production scale whether the company is small or large. This process of utilizing more advanced Capital features as the average user experience level increases and the design matures will be discussed from the experience at the EV startup Rivian.
gunter reichartMeeting the challenges of future mobility – The AUTOSAR  SW framework and its future evolution

Dr. Günter Reichart, AUTOSAR Spokesperson Europe

AUTOSAR as a worldwide development partnership has grown to over 360 partner companies over the last 20 years and aimed from its very beginning to develop an open standardized software architecture. Based on the well-established high-quality standards, mature processes, and strong communication channels inside this organization, AUTOSAR has been coping with the challenging market trends in the automotive industry. It was always clear that AUTOSAR can not cover all aspects of future vehicle challenges alone. Therefore, AUTOSAR was and is continuously looking for partners or consortia which bring in their particular know-how or complementary solutions which can fill the gaps in the areas AUTOSAR is not covering. Collaborations with ASAM, KHRONOS, MISRA or ROS are examples. Moreover, AUTOSAR will open even possibilities for collaboration with open-source activities.  With this combined effort AUTOSAR will provide together with its partners an industrial ecosystem, which meets the challenge of future mobility. 
From system architecture to integrated code: using multi-layer architecture to master software defined vehicle challenges

Peter Schedl, Program Manager Industry Solutions, IBM

Dr Jan Richter,
Domain Director Embedded Software Components, Siemens

Embarking on the software-intensive products journey promises new business models to vendors, where software defined vehicle is a prominent example of trends ongoing also in other industries. At the same time, the software defined vehicle significantly mandates significant changes in E/E architecture drives up the amount of software content. Engineering teams separated by discipline and working on disconnected requirements and siloed engineering data with document-centric hand-over according to plan-driven development processes inherited from the age of mechatronics elevate the risk of failure to deliver increasing content in expected certifiable quality on time and budget. 

In this talk, we explain how IBM and Siemens can help our customers connecting vertical design layers and engineering disciplines from requirements on system level to engineering designs on component level, and horizontally from design stage to verification and validation. With IBM Rhapsody and Siemens Capital E/E solutions, customers start their software-intensive product journey integrated and stay integrated all the way throughout the vehicle lifecycle.
image of erica van berkemThe path to generative design for E/E systems

Erica Van Berkum, Technical Product Management Manager, Siemens Digital Industries Software

With the relentless wave of electrification and fresh disruption from new entrants, electrical system platform producers in Automotive and Heavy Equipment industry are faced with disruption and opportunity. Can the realization of a true digital thread enable us to exploit these trends, and deliver on the promise of the model-based enterprise? In this presentation we will showcase tomorrow’s products and the demands they make for model-based flows, and the tools available today to address them.
Lena Stein Sustainability in the automotive wiring harness industry

Lena Stein, Market Development Automotive, Siemens Digital Industries Software

The automotive industry is facing global challenges that require a transformational change – making sustainability the #1 strategic issue. On the way to more sustainable electrical and electronic (E/E) systems, transparency throughout the value chain is one of the most important aspects. This can be achieved with comprehensive digital twin technology by creating an end-to-end digitized process chain. Join us to learn how Capital™ Software as part of the Siemens Xcelerator portfolio enables wire harness manufacturers to make better informed design decisions and thus help them achieve their sustainability goals.
harness panel-IESF2022 Panel: OEMs and Wiring Harness Manufacturers – Opportunities and Challenges

Christian Infanger, Director Product Group Harness Assembly, Komax
Doug Burcicki, Senior Director – Automotive & Heavy Equipment, Siemens Digital Industries Software
Other Tier 1 suppliers and OEMs to be announced

With the growing complexity of electrical content in end products, verifying this content early in the design process and as quickly as possible is becoming more critical, especially in the wiring harness business. Whether the wire harness manufacturers are using a Build-to-Print, Build-for-Manufacturing, or Full-Service Supplier approach, the transfer of data between design phases needs to be quick and minimize data re-entry. Wire harness manufacturing is a low-margin business. Mistakes not caught during the earlier stages of development can be very costly. So how can we pull these changes ahead and get to a robust process? Please join us for a discussion with representatives from some of the top wire harness manufacturers in the world as we discuss some of the challenges they are seeing with existing processes and tools and some opportunities that can help both OEMs and wire harness manufacturers.

A full day of workshops, networking and solution showcases

Today, IESF remains a unique mixture of technical and business presentations, panels and workshops that tackle some of the biggest topics facing our industry. These include dedicated breakout tracks on Vehicle Electrification, Autonomous Drive, E/E Systems Development, Accelerated Product Development, Software and Systems Engineering.

IESF remains a free event and includes an expo and networking opportunities.

Find out more.

This article first appeared on the Siemens Digital Industries Software blog at