Every year, 3D InCites, an online media resource dedicated to all things 3D in the semiconductor industry, recognizes company and individual contributions to the development of the heterogeneous roadmap, including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration, via their 3D InCites awards program. Nominations can be submitted by anyone in the industry. The winners are then chosen, not by 3D InCites, but by industry peers, through an online vote.
This year, Mentor was nominated by one of our customers, eSilicon, for our Xpedition® Substrate Integrator (xSI) and Calibre® 3DSTACK technologies that enabled them to find and eliminate a significant design error. During the development of a complex finFET-class ASIC, eSilicon had to make several modifications to netlist names and package connectivity to maintain compatibility with a legacy product. Those changes created the opportunity for inconsistent data. The use of xSI and Calibre 3DSTACK functionality to run a system-level LVS allowed eSilicon to detect and eliminate errors that would have cost them significant time and money.
Mentor is honored to have received the EDA Provider of the Year award, not just for the last three years, but in five out of the seven years the awards program has been in existence. The overwhelming industry support shown this year, with Mentor receiving nearly 71% of the votes cast, reaffirms our commitment to innovation and excellence in our toolsuite. Thank you to everyone who supported us, and thank you to our customers who are the reason we do what we do!