Siemens Digital Industries Software Blogs

Every SoC team I talk to has been told to shift left: find problems early, where they are cheap to fix. Yet on most projects, the first model that is both accurate about performance and actually connected to the implementation is still the RTL, and by the time it exists, the architecture is locked in.

IBM and Siemens are researching virtual models of IBM’s nanostack architecture to assess device performance and manufacturing challenges in the angstrom era.

We’re pleased to share an important licensing update for NX X Manufacturing customers that expands access to NX X Manufacturing...

Tuomas Rahkola and Teemu Kivelä won the 2026 FAME Additive Manufacturing Design Challenge with a bracket concept developed through research,...

Designing a printed circuit board (PCB) takes more than getting the layout right. The choices you make about materials, features...

Discover how engineers use DOE, Pareto analysis, and geometric deep learning to build a AI-augmented workflow for evaluating aircraft wing structural designs more than 1,000x faster.

From the independent designer to the global enterprise, scalable engineering starts with reliable data, disciplined workflows, and decisions connected across the product lifecycle.

Continue  This entire project is intended to be done within the free trial period.   [This is Part 5 of the...

Continue  This entire project is intended to be done within the free trial period.   [This is Part 4 of the...