Tessent™ Multi-die: The Era of 3DIC

In the ever-evolving world of technology, the drive to achieve higher performance, greater efficiency, miniaturization, and cost-effectiveness in the realm…

Unlocking Design Reliability: Introducing the Insight Analyzer Tool

In the fast-paced world of circuit design, ensuring reliability and performance is paramount. The Insight Analyzer tool has emerged as…

Transforming PCB Design: Embrace the Next Generation of Xpedition UX

In today’s rapidly evolving technological landscape, where artificial intelligence is reshaping industries, it’s only fitting that PCB design tools step…

Solido Design Environment: A Solution for Variation-Aware and High Sigma Verification Challenges

In electronic design, staying ahead of the curve and utilizing cutting-edge tools for success is crucial. We’re excited to announce…

Tessent Multi-Die: The Era of 3DIC

In the ever-evolving world of technology, the drive to achieve higher performance, greater efficiency, miniaturization, and cost-effectiveness in the realm…

Beat the Heat: Essential Backup Strategies for Your Xpedition Designer Projects

In the sweltering heat of summer, just as you wouldn’t venture out without sunscreen, your Xpedition Designer projects shouldn’t be…

Level 2 Certification Release Announcement. In Memory of Chris Spear

Elevate Your Skills with Education Reach for the Stars with Siemens EDA Level 2 Certification Badges! We have some exciting…

Enhance your User2User conference experience! Sign up for a training session the day before U2U Silicon Valley. Receive a free Siemens EDA ODT subscription. Keep on learning all year long.

User conferences are a great way to network and learn from your peers.  This year, for the first time, we are…

Enhance Test Time and Quality with Tessent Hybrid TestKompress/LogicBIST

As a TessentTM  software user, you’re probably familiar with TessentTM  TestKompress software and TessentTM  LogicBIST software (logic built-in self-test) for…