Learn how Qualcomm reduced test pattern count using Tessent testpoint technology. This video was recorded at the 2023 European User2User conference.
Learn how Testonica used Tessent to implement an FPGA-based reference system for pre-silicon evaluation and validation of a target IJTAG infrastructure. This video was recorded at the 2023 European User2User conference.
Learn how NXP Semiconductors implemented in-system test for automotive devices using Tessent, recorded at the 2023 European User2User conference.
Hear about Intel’s use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.
Learn how Intel adopted Tessent SSN packet-based ATPG and reduced test time by 34% in this video recorded at the 2023 North America U2U symposium.
Learn how Broadcom used Tessent Multi-die to build a 3D IC flow in this video recorded at the 2023 North America U2U symposium.
Learn how NXP achieves zero defects for bridging defects with Tessent’s defect oriented test in this video recorded at the 2023 North America U2U symposuim.
Break through yield barriers with Siemens and PDF Solutions. Watch this video recorded at the 2023 North America U2U symposuim.
There’s lots of action right now in refreshing popular test standards and developing new ones. Read this update on the friends and family of IEEE 1149.1 JTAG and IEEE 1687 IJTAG.
