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Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

April 19, 2013

In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is…

By Robin Bornoff
4 MIN READ
So, you want to predict component temperatures do you? Part VI

So, you want to predict component temperatures do you? Part VI

December 17, 2009

On the sliding scale of thermal component model representation king of all is a ‘detailed’ model. A 3D definition of…

By Robin Bornoff
4 MIN READ
So, you want to predict component temperatures do you? Part V

So, you want to predict component temperatures do you? Part V

December 7, 2009

Like a river this blog series is slowing down due to its increased width and depth, that and a lot…

By Robin Bornoff
3 MIN READ
“All models are wrong, but some are useful” Part III

“All models are wrong, but some are useful” Part III

June 5, 2009

The next two parts in this series focus on the thermal model representations of electronic objects. The first being packages,…

By Robin Bornoff
5 MIN READ