Come and Learn about the Latest Release of FloTHERM, V10

Come and Learn about the Latest Release of FloTHERM, V10

The latest release of FloTHERM, V10, is now available! It is a major release, satisfying over 40 software enhancement requests…

Happy 25th Birthday FloTHERM !

Happy 25th Birthday FloTHERM !

Late in 1988 two key employees of CHAM (Concentration Heat And Momentum Ltd.), the first commercial CFD vendor and at…

Why Not Just Shove a Heatsink on Top of it? Part 3: Pads, Vias and Undersinking

Why Not Just Shove a Heatsink on Top of it? Part 3: Pads, Vias and Undersinking

An appreciation of heat flow paths is a pre-requisite for good thermal design. If you attempt to augment heat flow…

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets

Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At…

Why Not Just Shove a Heatsink on Top of it? Part 1

Why Not Just Shove a Heatsink on Top of it? Part 1

A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should…

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is…

CFD – Colourful Friday Distractions

CFD – Colourful Friday Distractions

By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with…

Experiment vs. Simulation, Part 4: Compact Thermal Models

Experiment vs. Simulation, Part 4: Compact Thermal Models

Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative…

Experiment vs. Simulation, Part 3: JESD51-14

Experiment vs. Simulation, Part 3: JESD51-14

The JESD51-14 standard was published in November 2010, prepared by theĀ  JEDEC JC-15 Committee on Thermal Characterization. It outlines a…