What’s New in Innovator3D IC solution suite release 2510
Powering next-generation semiconductor integration
Innovator3D IC solution suite release 2510 marks a groundbreaking first release of the comprehensive Innovator3D IC solution suite—a seamlessly integrated platform crafted specifically for the complex workflows of 2.5D and 3D heterogeneous integration in semiconductor packaging. This suite unites four core technologies to deliver unmatched design planning, prototyping, analysis, and data management capabilities essential for advanced semiconductor innovation.
The Innovator3D IC solution suite at a glance
The 2510 release delivers an integrated ecosystem including:
- Innovator3D IC Integrator (i3DI): Fast, predictive ASIC and chiplet integration with digital twin modeling for optimized package design, simulation, and manufacturing handoff.
- Innovator3D IC Layout (i3DL): Collaborative, rules-driven physical design for advanced substrates and interposers with direct compliance to leading foundry certifications.
- Innovator3D IC Protocol Analyzer (i3DPA): Cutting-edge interconnect compliance and high-speed serial link simulation, including UCIe protocols powered by advanced 3D EM modeling.
- Innovator3D IC Data Management (i3DDM): Robust management of complex source files, revisions, and IP collaboration across distributed design teams.
Innovator3D IC Integrator (i3DI): A unified digital twin for package integration
At the heart of this release is the Innovator3D IC Integrator—your cockpit for managing the entire semiconductor package lifecycle. i3DI builds an optimized digital twin of heterogeneous ASIC and chiplet assemblies using the latest 2.5D and 3D IC technology platforms and substrates.
Key highlights in 2510:
- Accelerated architecture and performance
- 3Dblox compliance and certification
- Sub-nanometer precision
- Daisy-chain test vehicle design
- AI-driven enhancements
- Proactive Power Delivery Network (PDN) Design
Other productivity enhancements include scalable hierarchical device planning interfaces, enriched internal connectivity support with System Verilog and BUF constructs, and user-configurable automation icons—making i3DI a truly flexible and powerful platform.
Innovator3D IC Layout (i3DL): Precision and speed in physical implementation
2510 improvement highlights:
- Optimized architecture with faster design database serialization and internal synchronization.
- Up to 4x faster forward annotation between Integrator and Layout tools, ensuring quick updates even with rising pin counts.
True fiducial support places marked alignment references on top and bottom die layers. This enables precise buried die alignment without resorting to workaround artifacts, streamlining stacked die fabrication workflows.
Innovator3D IC Protocol Analyzer (i3DPA): Advanced high-speed link analysis
Engineered for early predictive analysis, i3DPA supports GHz-level simulations, standards-based UCIe compliance, and vendor-specific IBIS-AMI models. This tool excels at post-route, system-level channel verification with 3D EM modeling tailored for complex semiconductor packages.
2510 breakthroughs include:
- Support for full-wave and hybrid solvers alongside quasi-static Fast3D methods.
- Integrated graphical schematic canvas for pre-route interconnect visualization.
- AI-powered Design Space Exploration (DSE) integrated into 3D Explorer to optimize UCIe breakout routing.
- Ready-made configuration templates for rapid compliance analysis and what-if scenario prototyping.
Innovator3D IC Data Management (i3DDM): Taming complexity at scale
In an environment shaped by immense source data volume and cross-team collaboration, 3DDM orchestrates reliable IP and data management. It treats sets of diverse files like LEF/DEF or CSV sources as single source elements, ensuring cohesive revision control and precise traceability.
Major features in 2510:
- Automatic registration and version control for complex multi-file source imports (Verilog, CSV, 3Dblox, etc.).
- Comprehensive export and integration “snapshot” tracking.
- Traceability reports detailing who imported which files and when.
- Controlled definition of exact source data driving tapeout-ready design releases.
Why Innovator3D IC 2510 matters
With this inaugural release, Siemens introduces a powerful, scalable platform that revolutionizes heterogeneous 2.5/3D IC design by integrating unparalleled digital twin fidelity with AI-accelerated workflows and robust data management. Innovator3D IC 2510 empowers semiconductor innovators to accelerate time to market while mastering complexity—driving next-generation electronics towards higher performance, tighter integration, and sustainable innovation.
Start your Innovator3D IC journey with 2510 — a unified, intelligent, and scalable approach to semiconductor package design and analysis designed for today’s most challenging heterogenous integration demands.
