Products

From AI to Orbit: Five Initiatives Shaping the Future of Aerospace

In 2025, five key themes have emerged, offering a snapshot of where the defense, aviation, and space industries are headed next.

By Danny Santoro

From AI to orbit: 5 initiatives shaping the future of aerospace

In 2025, five key themes have emerged, offering a snapshot of where the defense, aviation, and space industries are headed next.

By Originally Published by Altair

Calibre IC Design & Manufacturing

Smart strategies for metal fill extraction

By Shehab Ashraf As semiconductor technology continues to scale, the impact of parasitic effects from metal fill structures has become...

By Calibre IC Design & Manufacturing

Electronic Systems Design

PCB high voltage spacing: What every engineer should know

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.

By Stephen V. Chavez

What’s new in Opcenter Research Development and Laboratory version 2504

Extended Bill of Materials (BoM) search & filter functionality, enhanced component function declaration and multiple best practices included in standard...

By Naomi Rietzel

Designcenter Solid Edge

Rethinking Public Transport

Designcenter Solid Edge helps Tremonia Mobility design environmentally friendly, efficient, and customizable minibuses In the evolving world of mobility, one...

Digital Logistics

XCargo 2503: Revolutionizing logistics with UX refresh and Teamcenter Share integration

Siemens Digital Logistics is excited to announce the new release of XCargo, featuring gamechanging enhancements that will transform your logistics...

Simcenter Executable Digital Twin – The leap forward in digital twin technology

Siemens is excited to announce the release of Simcenter Executable Digital Twin, enabling you to deliver smart products and processes by connecting the real and physical worlds.

By Leoluca Scurria, Christina Kothlow

Semiconductor Packaging

What’s new in IC Packaging 2504

To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.

By Keith Felton