A Dovetail hydrogen-electric aircraft flying above clouds at sunset.

The Future of Hydrogen-Electric Propulsion with Siemens and Dovetail

Join Siemens VP Aerospace, Defense, and Marine Industry, Todd Tuthill, and Dovetail CEO, David Doral, and as they discuss the…

Forged in War, Proven in Business: The Story of Peng Cau

What does it take to build a company from nothing—and then start again to help others do the same? How…

Ep 20 – More Perspectives on the Shift-Left and the Comprehensive Digital Twin with Mike Crist and Scot Morrison – Part 1

Season 2 of the Industry Forward Podcast continues with another three part series on the intricacies of shifting-left with the…

A bright future of AI in Operational Technology

Merging AI with operational technology (OT) is no simple task, between concerns about robustness and reliability as well as data…

Convergent and divergent needs of the automotive and heavy equipment industries – Ep. 9

Automotive and the heavy equipment industries face similar challenges on the round to deploying software-defined vehicles (SDVs) and autonomy more…

Folge 2 I Engineering und Simulation harmonisch vereint: Ihr Weg zu höheren Margen

Wenn Konstruktion, Simulation und Tests nahtlos zusammenspielen, gewinnen Sie Zeit, senken Kosten – und steigern Ihre Marge. In Episode 2 sprechen wir darüber, wie Datendurchgängigkeit und Simulation Ihren Produktentstehungsprozess im Maschinen- und Anlagenbau spürbar effizienter machen.

Aircraft engines being maintained in a hangar.

The Full Potential of Digital Transformation in Aerospace Factories – Smart Manufacturing in A&D Ep. 7

The production digital twin offers many ways for aerospace manufacturers to improve their manufacturing processes, from simulating plans before building…

Ep 19 – Shifting Left with the Comprehensive Digital Twin with Doug Burcicki and Scot Morrison – Part 3

Today on the Industry Forward Podcast, we bring you the final part of our discussion with Doug Burcicki, Senior Director…

3D IC podcast Why traditional PCB methods fall short in 3D IC design

Why traditional PCB methods fall short in 3D IC design

Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process? In…