Siemens Digital Industries Software Blogs

The semiconductor industry is steadily moving toward multi-die integration, where chiplets from different sources are combined within a single package (known as a system in package or SiP) to deliver higher performance, scalability, and efficiency. The Universal Chiplet Interconnect Express (UCIe) standard is the backbone of this movement, offering a high-bandwidth, low-latency interconnect that enables heterogeneous chiplets to operate as one system. UCIe 3.0 raises the bar once again. By adding higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, the standard improves both performance and efficiency. But it also increases verification complexity.

The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,...

Download “Accelerating electric drivetrain innovation” Electrification in automotive industry We’re excited to announce the release of our latest white paper,...

Lightera cut product development time by 25% with Siemens Teamcenter X, streamlining documentation, collaboration, and innovation.

beneath the surface of every high-performance circuit lies an unsung champion: Impedance (Z).

Our collaborative virtual development environment empowers teams to innovate faster, reduce errors, and improve decision-making throughout the product lifecycle.

In today’s semiconductor manufacturing, the pursuit of perfection leaves no room for error. Traditional testing methodologies often miss subtle yet...

The Industry Forward Podcast continued with another three part series on the intricacies of shifting-left with the comprehensive Digital Twin....

In a small town in Costa Rica, FIFCO began with a simple ice manufacturing plant 115 years ago. Today, the...