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Siemens Digital Industries Software Blogs
Opcenter
Extend digital efficiencies across the supply chain - Part 1
September 19, 2023
Welcome to the first in a series of three blogs about extending digital efficiencies across the supply chain. By implementing modern digital manufacturing software, production facilities have made great strides to increase throughput, decrease operational expenses and add to net profits.
By Luca Ianniello
3
MIN READ
Teamcenter
How to solve the color complexity puzzle in product engineering?
September 19, 2023
How to use Teamcenter Color BOM capabilities to auto-generate buildable combinations based on marketing features and constraints?
By Venkat Gonuguntla
3
MIN READ
Partners
Transformation to SaaS – Building a financial and operational strategy for transformation
September 19, 2023
In our first blog on partner SaaS transformation, we discussed the need for change and realistic ways to make it...
By Toni Reszka, Ryan Morris
5
MIN READ
Thought Leadership
Marine STS – Integrating Simulation into Sustainable Ship Design – Summary
September 19, 2023
The Marine Industry Podcast Series continues its exploration of the role of STS in the marine industry, guided by Jan...
By Quinn Foster
3
MIN READ
Electronic Systems Design
What's new in PADS Professional VX.2.14
September 19, 2023
PADS Professional is the best-in-class PCB design and analysis software for individuals and small workgroups. The PADS Professional desktop is...
By Jim Martens
< 1
MIN READ
Electronic Systems Design
What’s new in Xpedition VX.2.14
September 19, 2023
The new VX.2.14 release of Xpedition Enterprise includes improvements to design capture, multi-board systems design, library and design data management,...
By David Wiens
2
MIN READ
Electronic Systems Design
What’s new in HyperLynx VX.2.14
September 19, 2023
The new VX.2.14 release of HyperLynx contains improvements across: HyperLynx DRC HyperLynx DRC includes a new via length rule that...
By Todd Westerhoff
< 1
MIN READ
Siemens Software Podcast Network
Electrical/electronic co-design
September 19, 2023
Electrical/electronic co-design can enhance your end product but changes in the design process can be difficult for many people, and...
By Stephen Chavez
< 1
MIN READ
Semiconductor Packaging
What’s new in Xpedition IC Packaging VX.2.14
September 19, 2023
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package...
By Keith Felton
2
MIN READ
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Latest podcast episodes
The Industry Forward Podcast
The foundation of financial AI: data, governance, and trust
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Before organizations can fully deploy advanced AI and agent-based solutions, they need clean and contextualized data.
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< 1
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General
30 Companies. 27 Exits. What Chad Wasilenkoff sees that others don’t
July 30, 2026
Chad Wasilenkoff is not a typical founder. He started selling golf balls at eight years old, was buying and selling...
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2
MIN READ
The Industry Forward Podcast
Get with the program: Industrial AI won't suddenly vaporize
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Those clinging to the ways before industrial AI will be left behind.
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< 1
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