Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Electronic Systems Design

What’s new in PADS Professional release VX.2.13

The new VX.2.13 release of PADS Professional has improvements for the following features in PADS Professional layout. Enhancements to the...

Semiconductor Packaging

What’s new in Xpedition IC Packaging release VX.2.13

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which...

Electronic Systems Design

What’s new in Xpedition Enterprise release VX.2.13

The new VX.2.13 release of Xpedition has improvements across three key areas: Layout, data management, and verification. Improvements in Layout...

Electronic Systems Design

What’s new in HyperLynx release VX.2.13

The new VX.2.13 release of HyperLynx delivers state of the art simulation capabilities to mainstream designers by combining advanced modeling...

NX Design

Simplify Assembly | Part Two | Tips and Tricks

We’re back with another entry into our latest NX™ software Tips and Tricks. We’re taking a closer look at the...

Simcenter

Serving a perfect Stout - the CFD way

It's International Beer Day. Enjoy a stout the CFD way!

Teamcenter

💻 2023 Teamcenter BETA testing event

Register now for 2024 Teamcenter Beta Testing event - this April. Join us to shape the future of Teamcenter!

Thought Leadership

Designing the next generation of power efficient AI chips part 1

Artificial intelligence is continuing to take an increasingly important role in new software and technology each year. However, even as...

Thought Leadership

Hydrogen-powered aircraft design can take off with digitalization

With climate change increasing in intensity across the world, the push for sustainability in the aviation industry has never been...