Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

How Simcenter is accelerating innovation across industries

This article examines how manufacturers across aerospace, automotive, pharmaceuticals, consumer goods and other industries are leveraging the power of simulation and AI to transform product development. ...

By Steve Hartman

Accelerate your Simcenter 3D Rotor Dynamics analysis

Leveraging HPC capabilities on AMD central processing units (CPUs) to improve rotor dynamics analysis What is rotor dynamics analysis? Turbomachine...

By Caroline Raick, Karim Hamiche

Electronic Systems Design

Unleash the power of DDR5 & LPDDR5 parallel simulations

With the release of HyperLynx 2604, Siemens EDA is empowering engineers to do just that, thanks to the new DDRx Batch Wizard Parallelization Support.

By Sajeda Tamimi

Teamcenter X vs Teamcenter

A customer recently said, “I don’t know how that works in Teamcenter X, I’m only familiar with Teamcenter”. It made me realize that we need some clarification on...

By Susan Zimmerlee

Beyond optimization: how semiconductor manufacturing is entering the era of autonomous decision-making

Semiconductor manufacturing has always operated at the edge of what is technically and operationally possible. Precision has long been non‑negotiable, complexity unavoidable. What...

By Cheyenne Goeminne

What LAER maturity means for you as a Siemens partner: part 1

Moving from feature-led selling to lifecycle-led growth Winning the initial sale still matters. But in a recurring revenue model, the...

By Bill McInnis

Semiconductor Packaging

Streamlining 3D IC design interface performance

If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key.

By Keith Felton

Electronic Systems Design

What's new in Z-planner Enterprise 2604

This release focuses on delivering greater accuracy, improved efficiency, and expanded capabilities for engineers tackling today’s complex electronic designs. Let’s...

By Patrick Hope

Managing change at scale: how Teamcenter simplifies multi-BOM edits

In today’s complex product development landscape, change is inevitable — and often urgent. Whether it’s a supplier discontinuing a critical component,...

Latest podcast episodes

The Industry Forward Podcast

Expert predicts the digital future of the green process industries

What paths must green process industries take to make alternatives of traditionally petrol-based products?

By Shawn Wasserman

The hidden time bomb: Engineering reliability into 3D IC from day one

“Do not treat reliability as an afterthought, something which you just do at the very end of the design process,...

Zero trust in silicon: The new security imperative for chiplet-based 3D ICs

“You don’t just say, the other chiplet that’s on this die, I’m going to trust it, it’s fine. No —...