Log in
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • Additive Manufacturing Software
    • Aprisa
    • Capital
    • Catchbook
    • Custom IC
    • Design with Calibre
    • Digital Logistics
    • EDA Consulting Services
    • Electronic Systems Design
    • Fibersim
    • Hardware Assisted Verification
    • HLS Design & Verification Blog
    • Insights Hub
    • JT
    • Mendix
    • NX Design
    • NX Industrial Electrical Design
    • NX Manufacturing
    • Opcenter
    • Pave360
    • PLM Components
    • Polarion
    • Questa
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Solid Edge
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
  • Industries
    • All Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • Additive Manufacturing Podcast
    • AI Spectrum
    • Bugged Out
    • Cloud Talk Today
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Empowering Engineering Educators
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Engineering the Future Workforce
    • Model Based Matters
    • Next Generation Design Podcast
    • On the Move: A Siemens Automotive Podcast
    • Pioneers: Startups from Dreams to Reality
    • Printed Circuit Podcast
    • Security by Design
    • Talking Aerospace Today Podcast
    • The Battery Podcast
    • The Digital Dig - A Siemens Heavy Equipment Podcast
    • The Industry Forward Podcast with Dale Tutt
    • The Marine Industry Podcast Series
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
    • German only Podcasts
    • Machinenbau Talk
  • Thought Leadership
    • All Thought Leadership
    • Digital Transformation
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • The Art of the Possible
    • Thought Leadership
    • Verification Horizons
  • Corporate
    • All Corporate
    • Academic and Future Workforce
    • AWS Partnership
    • Corporate Blog
    • Cre8Ventures (Siemens EDA)
    • EDA Support Blogs
    • Employee Spotlight
    • Partners
    • Realize LIVE
    • Siemens Xcelerator Academy
    • Siemens Xcelerator Software for Industry
    • Small & Medium Business
    • Xcelerator for Startups Videos
  • Community
  1. Home
  2. Industries

Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


NX Design

What’s New in NX | June 2025 | Core Design

June 25, 2025
Welcome to the latest edition of What’s New in NX™ software series! Built around industry-specific workflows, NX is the engine behind the...
By Sebastien Schultz
4 MIN READ

Simcenter

Shake it and drop it! Testing for laptop reliability

June 25, 2025
Did your laptop ever let you down right before that important presentation? Learn here how the Mission Synthesis testing method ensures laptop reliability.
By Frank Demesmaeker
8 MIN READ

Semiconductor Packaging

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025
Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional...
By John McMillan
6 MIN READ

Polarion

Siemens Polarion for IBM Rational DOORS Classic user

June 24, 2025
Blog-Series 2: How to use filter 1. General Introduction In this blog-series we want to show you how to work...
By dennis.pfeiffer
7 MIN READ





Simcenter

The cool factor: Additive manufacturing is redefining cold plate design

June 20, 2025
Siemens interns for 2024/25, took part in the ASME K-16 and IEEE EPS Student Cold Plate Design Challenge. Find out how CFD simulation and design for additive manufacturing were combined to optimize their cold plate design for performance that reached the final of the 2025 competition.
By Yue Heng Tan, Adam Blackwood, Derin Castaban, Nimrit Kanwal, Isaac Waters
9 MIN READ

Verification Horizons

Industrial-Grade AI in EDA: From Promise to Practice — A Siemens Panel at DAC 2025

June 17, 2025
Industrial-Grade AI in EDA
By Harry Foster
2 MIN READ

Simcenter

Too hot - too shaky? Thermal testing and vibration control testing come to the rescue of electronic systems

June 17, 2025
Thermal testing and vibration control testing play a key role in the development of electronic systems. 75% of electronic system failures are the result of high temperatures (55%) and excessive vibrations (20%). Learn more about techniques that can help you reduce these failures.
By Frank Demesmaeker
3 MIN READ

Verification Horizons

Generative AI: The Hype, The Hope, The Hard Truths — And the Debate at DAC

June 17, 2025
The semiconductor industry is no stranger to bold claims. But few topics today spark more debate — or more genuine...
By Harry Foster
2 MIN READ

Semiconductor Packaging

​Why Traditional PCB Methods Fall Short in 3D IC Design

June 16, 2025
In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with...
By John McMillan
11 MIN READ

Posts navigation

  • «
  • 1
  • …
  • 10
  • 11
  • 12
  • 13
  • 14
  • …
  • 104
  • »