Log in
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • Additive Manufacturing Software
    • Aprisa
    • Capital
    • Catchbook
    • Custom IC
    • Design with Calibre
    • Digital Logistics
    • EDA Consulting Services
    • Electronic Systems Design
    • Fibersim
    • Hardware Assisted Verification
    • HLS Design & Verification Blog
    • Insights Hub
    • JT
    • Mendix
    • NX Design
    • NX Industrial Electrical Design
    • NX Manufacturing
    • Opcenter
    • Pave360
    • PLM Components
    • Polarion
    • Questa
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Solid Edge
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
  • Industries
    • All Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • Additive Manufacturing Podcast
    • AI Spectrum
    • Bugged Out
    • Cloud Talk Today
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Empowering Engineering Educators
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Engineering the Future Workforce
    • Model Based Matters
    • Next Generation Design Podcast
    • On the Move: A Siemens Automotive Podcast
    • Pioneers: Startups from Dreams to Reality
    • Printed Circuit Podcast
    • Security by Design
    • Talking Aerospace Today Podcast
    • The Battery Podcast
    • The Digital Dig - A Siemens Heavy Equipment Podcast
    • The Industry Forward Podcast with Dale Tutt
    • The Marine Industry Podcast Series
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
    • German only Podcasts
    • Machinenbau Talk
  • Thought Leadership
    • All Thought Leadership
    • Digital Transformation
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • The Art of the Possible
    • Thought Leadership
    • Verification Horizons
  • Corporate
    • All Corporate
    • Academic and Future Workforce
    • AWS Partnership
    • Corporate Blog
    • Cre8Ventures (Siemens EDA)
    • EDA Support Blogs
    • Employee Spotlight
    • Partners
    • Realize LIVE
    • Siemens Xcelerator Academy
    • Siemens Xcelerator Software for Industry
    • Small & Medium Business
    • Xcelerator for Startups Videos
  • Community
  1. Home
  2. Industries

Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Custom IC

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025
At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.
By Ray Valencia
3 MIN READ

Custom IC

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

December 23, 2025
From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA's collaboration eliminates one of the biggest roadblocks in hardware security verification.
By Emma-Jane Crozier
3 MIN READ

Simcenter

Simcenter Physical Testing: The ultimate news you shouldn’t miss in 2025

December 19, 2025
Discover the latest news from Simcenter Physical Testing that are transforming the way engineers approach testing. Check back regularly as we continuously update this blog with the freshest Simcenter Physical Testing news, tips, and insights.
By Mathieu Sarrazin
29 MIN READ

Pave360

What to expect from PAVE360 Automotive at CES 2026

December 18, 2025
Experience PAVE360 Automotive in action and see how key industry players are using PAVE360 digital twin For the first time...
By Heather Campbell
4 MIN READ

Pave360

PAVE360 Automotive, what is an SDV Digital Twin Blueprint and why do you need one?

December 18, 2025
The Software Defined Vehicle (SDV) is both an opportunity and a challenge for automakers. There has been an explosion in...
By Heather Campbell
4 MIN READ


Electronics & Semiconductors

Fall Semiconductor Series Recap: How integrated software and automation transform fab sustainability 

December 16, 2025
The integrated imperative for optimized performance
By Kyle Fraunfelter, Melville Bryant
2 MIN READ

Valor

Design for ICT Testing: Driving Real Optimization in Electronics Manufacturing

December 16, 2025
Electronic Manufacturing Academy – Module 5 | December 18 At Goaltech’s Electronic Manufacturing Academy (EMA), we have created a learning...
By nava.shayovitz
2 MIN READ

Tessent Solutions

Beyond the core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight

December 15, 2025
Tessent UltraSight enables system-wide debugging for complex SoCs. A comprehensive solution, it combines embedded hardware IP with powerful host software to provide deep visibility into complex SoCs, supporting the development and optimization of high-performance embedded software.
By Tessent Solutions
3 MIN READ

Semiconductor Packaging

Key Thermal Advances Driving Next-Gen AI Chip Design in 2026

December 15, 2025
AI is hot — literally.  As we bid farewell to a transformative year of 2025, there’s no doubt that the AI chip underwent substantial changes. As AI compute is pushing...
By Andras Vass-Varnai
3 MIN READ

Posts navigation

  • 1
  • 2
  • 3
  • …
  • 104
  • »