In Part 1 of the blog series, we invited you to discover the latest PLM and EDA solutions to meet your advanced packaging design challenges at our presentation during the 19th annual Device Packaging Conference (DPC 2023) on March 15.
In Part 2, we’ll take a closer look at the challenges and solutions we will address at our presentation.
Engineering like Manhattan to manage the vertical challenge
As Manhattan discovered early in the twentieth century, there’s only so much real estate available. Similarly, our semiconductor industry today is running out of space available on the real estate of a chip. We can’t keep miniaturizing to keep up with Moore’s Law (doubling the number of transistors on a microchip every two years). So, to deliver more computing power in less space, we must go vertical like Manhattan. With advanced packaging design we can stack layers higher in the package, but to reach our higher performance goals, we must think differently.
Engineers are no longer dealing with just a flat chip packed with transistors. Advanced packaging design calls for multiple layers of transistors, which mixes electronics and mechanical domains as never before, along with stiffeners, interposers, interconnectors, and many other exacting components. So, there is a whole new set of mechanical, electronic, and material considerations, including thermal stability and stress factors that place new demands on packaging architecture, performance, and sustainability. To overcome these challenges, engineers must employ innovative structural techniques, materials, and integrated electronic design automation tools.
What is different about advanced packaging design solutions?
3D IC requires a much more complex package design, but the solution does not have to be complicated:
– First, you need seamless data exchange between all your CAD solutions, including ECAD, MCAD and CAE to ensure both data integrity and next-level productivity
– Second, you need to provide secure collaboration for all stakeholders in the product’s lifecycle management, including system engineers, manufacturing planning and operations engineers, who need to access the IP needed for reuse and continuous improvement
– Third, you need advanced simulation to be able to conduct electrical, thermal, and mechanical analysis from die to system level with the capabilities to optimize, test and calibrate, so design and thermal issues are spotted and solved early
Siemens PLM and EDA solutions for advanced packaging design
Our team of Siemens PLM and EDA experts are ready to answer your questions and provide demonstrations to help you overcome your challenges in advanced packaging design. To get the full story, we invite you to attend our presentation at DPC 2023 From Manhattan to Advanced Packaging Design on Wednesday March 15th from 6 – 8pm. If you cannot attend in person, please stay tuned to this blog – we will be posting our on-demand presentation here for you after the show.