Solido - Custom IC

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia

3 MIN READ

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA’s collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier

3 MIN READ

Edge AI Transforming Industrial Internet of Things

December 10, 2025

The Industrial Internet of Things (IIoT) is evolving rapidly, and Edge AI has emerged as one of its most transformative…

By Mary Rayburn

3 MIN READ

Driving the Future of Custom IC Design with AI: Highlights from Siemens EDA Forum Taiwan

October 7, 2025

The Siemens EDA Forum in Taiwan brought together a packed audience and an impressive showcase of booths from across the…

By siddharth ravikumar

3 MIN READ

Solido Custom IC at GTS 2025

September 23, 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August…

By Mohamed Atoua

2 MIN READ

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

August 29, 2025

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

By Emma-Jane Crozier

3 MIN READ

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier

3 MIN READ

EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

June 10, 2025

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.

3 MIN READ

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

By Emma-Jane Crozier

2 MIN READ