Electronics & Semiconductors

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia

3 MIN READ

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA’s collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier

3 MIN READ

Agentic IC design panel discussion at Solido Custom IC Forum

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

November 26, 2025

Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.

By Emma-Jane Crozier

3 MIN READ

Solido Custom IC at GTS 2025

September 23, 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August…

By Mohamed Atoua

2 MIN READ

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

August 29, 2025

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

By Emma-Jane Crozier

3 MIN READ

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier

3 MIN READ

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

By Emma-Jane Crozier

2 MIN READ

Heading to DAC 2025 with Microsoft: Novel TRNG Verification with a High-Performance Simulation Methodology

April 15, 2025

In our data-driven world, the need for robust security solutions continues to grow. At the heart of modern cryptographic systems…

By Lih-Jen Hou

2 MIN READ

Transform Your IP Selection Process with Solido Library Profiler

February 3, 2025

At the heart of every breakthrough technology lies intellectual property (IP), powering everything from cutting-edge System-on-Chips (SoCs) to specialized Application-Specific…

By Ray Valencia

3 MIN READ