Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


NX Manufacturing

Powering the hydrogen future: how Siemens Energy unified design, simulation, and manufacturing

Explore how Siemens Energy leverages Siemens Xcelerator portfolio, starting with its additive manufacturing capabilities, to transform how complex energy systems are designed and delivered. By connecting design, simulation, additive manufacturing, and production through a unified digital thread, the company streamlined workflows, reduced errors, and enabled rapid iteration at scale. This integrated approach accelerated the development of advanced hydrogen-powered gas turbine technology, improving efficiency while reinforcing Siemens Energy’s leadership in the transition to sustainable, low-carbon energy.

Insights Hub

Vorwerk’s Data-Driven Manufacturing Journey: Innovation, Integration, and What’s Next

One of the most exciting themes in modern manufacturing is that innovation is no longer just about adding new technology....

Insights Hub

Arca Continental’s Data-Driven Manufacturing Journey: From Transparency to Predictive Action

Digital transformation in manufacturing is exciting, but it is rarely simple. For global manufacturers, the challenge is not only about...

Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

Electronic Systems Design

What's new in Valor 2604

The latest release of Valor NPI 2604 continues to strengthen our Design-For-Manufacturing (DFM) validation by bringing new constraint types, additional checks and enhanced analysis capabilities.

Electronic Systems Design

What's new in Xpedition 2604

The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.

Electronic Systems Design

What's new in HyperLynx 2604

HyperLynx 2604 release brings a comprehensive set of enhancements that make PCB design verification faster, more intelligent, and more accessible

Semiconductor Packaging

What's new in Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.


Simcenter

NEW RELEASE: Simcenter HEEDS Connect 2604

Simcenter HEEDS Connect 2604 is here, and it's packed with powerful enhancements designed to help engineering teams collaborate seamlessly, explore possibilities together, and make more confident design decisions in real-time, online.