Going to DAC’2017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!

If you’re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you need to join us on Thursday for an exciting seminar.

On Thursday 22nd June Mentor will be hosting a half-day morning seminar focused on HDAP with specific focus on FO-WLP. Join us and listen to two informative industry guest speakers, hear from Mentor on its latest technologies and solutions for FO-WLP and HDAP and see live technology demonstrations.

Interested, sign-up here as seats are limited and going fast. We even provide a nice lunch to round off the event!!

http://go.mentor.com/4SQxm

We look forward to seeing and talking with you!!

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/xpedition/2017/05/26/going-to-dac2017-in-austin-tx-interested-in-high-density-advanced-packaging-then-read-on/